W7020 Datasheet, PDF (34/36 Pages) List of Unclassifed Manufacturers – Bluetooth Radio Module

W7020 Bluetooth Radio Module
Preliminary Data Sheet
September 2000
Soldering Profile
To prevent damage to the components from crack, etc., the following soldering steps should be followed:
1. Carefully perform preheating so that the temperature difference ∆T between the solder and the component
surface is in the range shown in Figure 18.
2. When the components are immersed in solvent after mounting, maintain the temperature difference within
100 ºC.
3. Use rosin type flux or weakly active flux with chlorine content of 0.2% weight or less.
4. Use eutectic crystal solder.
Soldering
Method
Reflow
Temperature
∆T ≤ 130 ºC
220 °C ~ 230 °C
WITHIN 10 s
200 °C
~230 °C
220 °C
PREHEATING
60 s MIN.
WITHIN 120 s
WITHIN 20 s
Figure 18. Solder Timing Diagram
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Lucent Technologies Inc.