NX29F010 Datasheet, PDF (23/25 Pages) List of Unclassifed Manufacturers – 1M-BIT (128K x 8-bit) CMOS, 5.0V Only ULTRA-FAST SECTORED FLASH MEMORY

NX29F010
PACKAGING INFORMATION
PLCC (Plastic Leaded Chip Carrier)
Package Code: PL
PIN 1
e
D1 D
C
b
b1
D2
E
E1
E2
Plastic Leaded Chip Carrier (PL)
Millimeters
Inches
Symbol Min Max Min Max
Ref. Std.
No. Leads
32
A
3.33 3.56 0.131 0.140
A1
0.50 – 0.020 –
A2
2.67 2.93 0.105 0.115
A3
1.91 0.81 0.026 0.032
b
0.66 8.10 0.311 0.319
b1
0.33 0.54 0.013 0.021
C
0.20 0.35 0.008 0.014
D
13.89 14.05 0.547 0.553
D1 14.86 15.10 0.585 0.595
D2
– 7.62 – 0.400
E
11.35 11.51 0.447 0.453
E1 12.32 12.57 0.485 0.495
E2
– 7.62 – 0.300
e
1.27 BSC
0.050 BSC
0^o
10^o 0^o
10^o
NexFlash Technologies, Inc.
NXPF001F-0600
06/22/00 ©
A
A3
A1
A2
SEATING
PLANE
Notes:
1. Controlling dimension: millimeters, unless other-
wise specified.
2. BSC = Basic lead spacing between centers.
3. Dimensions D and E do not include mold flash
protrusions.
4. Formed leads shall be planar with respect to one
another within 0.004 inches at the seating plane.
5. ND and NE represent the number of leads in D and
E directions, respectively.
6. D1 and E1 should be measured from the bottom of
the package.
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