DS_FT312D Datasheet, PDF (21/25 Pages) List of Unclassifed Manufacturers – Future Technology Devices International Ltd.

DS_FT312D USB ANDROID HOST IC Datasheet
Version 1.0
Document No.: FT_000816 Clearance No.: FTDI# 331
Profile Feature
Average Ramp Up Rate (Ts to Tp)
Pb Free Solder Process
(green material)
SnPb Eutectic and Pb free (non
green material) Solder Process
3°C / second Max.
3°C / Second Max.
Preheat
- Temperature Min (Ts Min.)
- Temperature Max (Ts Max.)
- Time (ts Min to ts Max)
Time Maintained Above Critical Temperature
TL:
- Temperature (TL)
- Time (tL)
Peak Temperature (Tp)
Time within 5°C of actual Peak Temperature
(tp)
Ramp Down Rate
Time for T= 25°C to Peak Temperature, Tp
Table 9.1Reflow Profile Parameter Values
150°C
200°C
60 to 120 seconds
217°C
60 to 150 seconds
260°C
30 to 40 seconds
6°C / second Max.
8 minutes Max.
100°C
150°C
60 to 120 seconds
183°C
60 to 150 seconds
see Figure 9-5
20 to 40 seconds
6°C / second Max.
6 minutes Max.
SnPb Eutectic and Pb free (non green material)
Package Thickness
< 2.5 mm
≥ 2.5 mm
Volume mm3 < 350
235 +5/-0 deg C
220 +5/-0 deg C
Volume mm3 >=350
220 +5/-0 deg C
220 +5/-0 deg C
Pb Free (green material) = 260 +5/-0 deg C
Table 9.2 Package Reflow Peak Temperature
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