FC1703 Datasheet, PDF (14/17 Pages) List of Unclassifed Manufacturers – Receiver RFIC for Dual-Band Triple Mode

Future
Communications
Integrated circuit Inc.
FC1703
Receiver RFIC for Dual-Band Triple Mode
RECOMMENDED BOARD LAND PATTERN DIMENSIONS
Z
G
A
D
W
X
Y
Size
4.36
2.98
2.78
2.68
0.22
0.28
0.69
All Dimensions in mm
- The solder mask opening should be 120 to 150 microns larger than the pad size resulting in 60
to 75 micron clearance between the copper pad and solder mask.
- Typically each pad on the PCB should have its own solder mask opening with a web of solder
mask between two adjacent pads.
- It should be noted that the inner edge of the solder mask should be rounded, especially for
corner leads to allow for enough solder mask web in the corner area.
- It is recommended that an array of thermal vias should be incorporated at 1.0 to 1.2mm pitch
with via diameter of 0.3 to 0.33mm.
- The mask opening should be 100 microns smaller than the thermal land size on all four sides.
- The solder mask diameter should be 100 microns larger than the via diameter.
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Last Update 03/28/03