FMM5061VF Datasheet, PDF (13/15 Pages) List of Unclassifed Manufacturers – X-Band Power Amplifier MMIC

FMM5061VF
X-Band Power Amplifier MMIC
■ Mounting Instructions for VF Package
1. Screw Mounting
(1) The flange of package may be attached using screws. Torque conditions are
shown in table 1.
Table 1. Recommended and Maximum Torque for Screw Mounting
Package
VF
Recommended
screw
M2.0
Recommended
Torque
Maximum Torque
10 N-cm (0.9 lb-in) 15 N-cm (1.3 lb-in)
(2) First, tighten the screws with a torque driver set to 5 N-cm.
(3) The surface finish of the heat sink should be better than 0.8 µm, and the
surface flatness must be better than 10 µm.
(4) Silicon based heat sink compounds should not be used for thermal
conductive grease. They cause poor grounding of the source flange,
contamination and long term degradation of thermal resistance between the
FET package and heat sink.
2. Solder Mounting
(1) Recommended solder are Tin-Lead solder (63Sn/37Pb), Lead-Free solder
(Sn-3.0Ag-0.5Cu)*¹ or equivalent.
(2) For soldering, Tin-Lead solder (63Sn/37Pb) or Lead-Free solder
(Sn-3.0Ag-0.5Cu)*¹ shall be used. (*1: The figure displays with weight %. A
predominantly tin-rich alloy with 3.0% silver and 0.5% copper.)
(3) Recommended Flux is Rosin type with chlorine content: 0.2% or less and a low
halogen content. After soldering, the flux residue should be removed by
appropriate cleaning methods.
(4) The recommended soldering conditions are as follows:
Partial heating method (soldering iron, spot laser/air)
Product terminal temperature: 260 deg-C, max. 10 s./terminal
or 400 deg-C, max. 3 s./terminal
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