WS256K32-XXX Datasheet, PDF (1/7 Pages) List of Unclassifed Manufacturers – 256Kx32 SRAM MODULE

WS256K32-XXX
HI-RELIABILITY PRODUCT
256Kx32 SRAM MODULE PRELIMINARY*
FEATURES
s Access Times 20, 25, 35ns
s MIL-STD-883 Compliant Devices Available
s Packaging
• 66 pin, PGA Type, 1.185 inch square, Hermetic
Ceramic HIP (Package 401)
• 68 lead, 40mm, Hermetic CQFP (Package 501)
s Organized as 256Kx32, User Configurable as 512Kx16
s Upgradable to 512Kx32 for future expansion
s Data I/O Compatible with 3.3V devices
s 2V Data Retention devices available
(WS256K32L-XXX low power version only)
s Commercial, Industrial and Military Temperature Range
s 5 Volt Power Supply
s Low Power CMOS
s TTL Compatible Inputs and Outputs
s Weight
WS256K32N-XHX - 13 grams typical
WS256K32-XG4X - 20 grams typical
* This data sheet describes a product under development, not fully
characterized, and is subject to change without notice.
FIG. 1 PIN CONFIGURATION FOR WS256K32N-XHX
TOP VIEW
1
12
23
34
45
56
I/O8
NC
I/O15
I/O24
VCC
I/O31
I/O9
NC
I/O14
I/O25
NC
I/O30
I/O10
A13
GND
I/O11
I/O13
I/O12
I/O26
A6
NC
I/O27
I/O29
I/O28
BLOCK DIAGRAM
A14
A10
OE
A15
A11
NC
A16
A12
WE1
A17
VCC
I/O7
A7
A3
A0
NC
A4
A1
A8
A5
A2
A9
WE2
I/O23
OE
A0-17
W E1C S 1
256K x 16
W E2 C S2
256K x 16
I/O0
CS1
I/O6
I/O1
NC
I/O5
I/O16
I/O17
CS2
GND
I/O22
I/O21
16
16
I/O2
I/O3
I/O4
11
22
33
I/O18
I/O19
I/O20
44
55
66
I/O0-15
I/O16-31
PIN DESCRIPTION
I/O0-31 Data Inputs/Outputs
A0-17
Address Inputs
WE1-2
Write Enables
CS1-2
Chip Selects
OE
Output Enable
VCC
Power Supply
GND
Ground
NC
Not Connected
October 2000 Rev. 2
1
White Electronic Designs Corporation • [phone] • www.whiteedc.com