WS1M32-XG3X Datasheet, PDF (1/8 Pages) List of Unclassifed Manufacturers – 1Mx32 SRAM MODULE

White Electronic Designs
WS1M32-XXX
1Mx32 SRAM MODULE
FEATURES
■ Access Times of 17, 20, 25ns
■ Packaging
• 84 lead, 28mm CQFP, (Package 511)
• 66 pin PGA Type, 1.385" sq., Hermetic Ce-
ramic HIP
(Package 402)*
■ Organized as two banks of 512Kx32, User
Configurable as 2Mx16 or 4Mx8
* Packagetobedeveloped.
PIN CONFIGURATION FOR WS1M32-XH2X*
TOP VIEW
1
12
23
34
45
56
I/O8
WE2
I/O15
I/O24
VCC
I/O31
I/O9
OE2
I/O14
I/O25
OE4
I/O30
I/O10
GND
I/O13
I/O26
WE4
I/O29
A13
I/O11
I/O12
A6
I/O27
I/O28
A14
A10
OE1
A7
A3
A0
A15
A11
A18
CS2
A4
A1
A16
A12
WE1
A8
A5
A2
A17
VCC
I/O7
A9
WE3
I/O23
I/O0
CS1
I/O6
I/O16
OE3
I/O22
I/O1
NC
I/O5
I/O17 GND
I/O21
I/O2
I/O3
I/O4
11
22
33
I/O18
I/O19
I/O20
44
55
66
■ Commercial, Industrial and Military Temperature
Ranges
■ TTL Compatible Inputs and Outputs
■ 5 Volt Power Supply
■ Low Power CMOS
■ Built-in Decoupling Caps and Multiple Ground
Pins for Low Noise Operation
■ Weight
WS1M32-XH2X* - 13 grams (typical)
WS1M32-XG3X - 20 grams (typical)
PIN DESCRIPTION
I/O0-31 DataInputs/Outputs
A0-18 Address Inputs
WE1-4 WriteEnables
CS1-2
Chip Selects
OE1-4 OutputEnable
VCC
Power Supply
GND
Ground
NC
Not Connected
BLOCK DIAGRAM
OE1 WE1
OE2 WE2
OE3 WE3
OE4 WE4
CS1
A0-18
5122KMxx88
5122KMxx88
5122KMxx88
512K x 8
512K x 8
512K x 8
5122MK x 8
512K x 8
8
CS2
I/O0-7
8
I/O8-15
8
I/O16-23
8
I/O24-31
NOTE: CS1& CS2 are used as bank select
July 2002 Rev. 4
1
White Electronic Designs Corporation • [phone] • www.whiteedc.com