SMD0805 Datasheet, PDF (1/2 Pages) List of Unclassifed Manufacturers – SMD Type, 6 V / 9 V / 15V

POLYFUSE^® RESETTABLE FUSES
SMD0805
formerly No. 725
Dimensions (mm)
SMD Type, 6 V / 9 V / 15V
Standard
UL 1434 1^st Edition
CSA C22.2 No. 0 CSA TIL No. CA-3A
Approvals
cULus Recognition
TÜV
Features
These devices offer wide range in hold currents
from 0.1 A to 1.0 A and voltages from 6 V to
15 V. The SMD0805 product line is suitable for
high density circuit board applications in com-
puters, cellular phone and general electronics.
Suitable for reflow soldering.
WebLinks
Further info see:
www.wickmanngroup.com
Further application info see fuseology:
www.wickmanngroup.com/download/fuseology.pdf
Solder pad Layout (mm)
1.2
1.5
Specifications
Packaging
A
Blistertape and reel Ø 178 mm
Materials
Terminals:
Solder-plated copper
TS: Solder Material: 63/37 SnPb
TF: Solder Material: Sn
Max. Device Surface Temperature in Tripped State
125 °C
Operating / Storage Temperature
-40 ºC to +85 ºC (consider derating)
Humidity Ageing
+85 °C, 85 % R.H., 1000 hours, ± 5 % typical
resistance change
Vibration
MIL-STD-883C, Method 2007.1, Condition A,
no change
Thermal Shock
MIL-STD-202F, Method 107G
+85 °C to -40 °C 20 times, -30 % typical resistance
change
Solderability
Meets EIA Specification RS186-9E,
ANSI/J-STD-002, Category 3
Reflow only
Solvent Resistance
MIL-STD-202, Method 215, no change
Marking
“P”, Part Code
Dimensions (mm)
Model
SMD0805P010TS/TF
SMD0805P020TS/TF
SMD0805P035TS/TF
SMD0805P050TS/TF
SMD0805P075TS/TF
SMD0805P100TS/TF
1.0
1.0
A
B
C
D
E
packaging quantity
Min Max
Min Max
Min Max
Min
Min Max
tape
2.00 2.20
2.00 2.20
2.00 2.20
2.00 2.20
2.00 2.20
2.00 2.20
1.20 1.50
1.20 1.50
1.20 1.50
1.20 1.50
1.20 1.50
1.20 1.50
0.55 1.00
0.55 1.00
0.45 0.75
0.75 1.25
0.75 1.25
0.80 1.80
0.10
0.20
0.45
0.10
0.20
0.45
0.10
0.20
0.45
0.10
0.20
0.45
0.20
0.15
0.45
0.20
0.15
0.45
4,000
4,000
4,000
3,000
3,000
2,000
Permissible continuous operating current is ≤ 100 % at ambient temperature of 20 ºC (68 ºF).
Model
I_hold
I_Trip
(A)
(A)
V_{max. dc}
(V)
I_max.
max. time to trip
P_{d max.}
(A)
(sec. @ A)
(W)
Resistance
Approvals
R _min.(Ω) R _typ.(Ω) R_{I max.}(Ω)
SMD0805P010TS/TF
0.10
0.30
SMD0805P020TS/TF
0.20
0.50
SMD0805P035TS/TF
0.35
0.75
SMD0805P050TS/TF
0.50
1.00
SMD0805P075TS/TF
0.75
1.50
SMD0805P100TS/TF
1.00
1.95
15
40
9
40
6
40
6
40
6
40
6
40
Please choose TS for SnPb and TF for Sn plating
NOTE:
I _hold =
I _trip =
V_max =
I _max =
Hold current: maximum current device will pass without tripping in 20 °C still air.
Trip current: minimum current at which the device will trip in 20 °C still air.
Maximum voltage device can withstand without damage at rated current (I _max)
Maximum fault current device can withstand without damage at rated voltage (V_max)
1.50 @ 0.50
0.02 @ 8.00
0.10 @ 8.00
0.10 @ 8.00
0.20 @ 8.00
0.30 @ 8.00
0.5
1.000
3.500
6.000
••
0.5
0.650
2.000
3.500
••
0.5
0.250
0.750
1.200
••
0.5
0.150
0.500
0.850
••
0.6
0.090
t.b.d.
0.350
pp
0.6
0.060
t.b.d.
0.210
pp
P_d = Power dissipated from device when in the tripped state at 20 °C still air.
R _min= Minimum resistance of device in initial (un-soldered) state.
R = _1max Maximum resistance of device at 20 °C measured one hour after tripping for 20 s.
Caution: Operation beyond the specified rating may result in damage and possible arcing and flame.
Specifications are subject to change without notice
Order
Information
Qty.
Order-
Model Packaging
Number
WebSite
Europe Tel: [phone] Americas Tel: [phone]
Asia Tel: [phone]
China Tel: [phone]
040617 www.wickmanngroup.com E-mail: [e-mail] E-mail: [e-mail] E-mail: [e-mail] E-mail: [e-mail]