MULTIWATT Datasheet, PDF (1/2 Pages) List of Unclassifed Manufacturers – MULTIWATT

®
Thermal Data
MULTIWATT Family
8,11,15 leads (JEDEC MO-048 )
8 leads
item #
leadframe
slug
die attach
molding
compound
11 leads
15 leads
PACKAGE MATERIAL LIST
material
thickness
thermal
conductivity
copper
0.5 mm
3.9 W/cm°C
high thermal
conductivity Cu
1.5 mm
3.9 W/cm°C
soft solder
( tin / lead )
15-50 µm
0.2 W/cm°C
epoxy resin
3 mm
0.0063W/cm°C
Typical assembly configuration before molding :
Charts enclosed :
1) Rth(j-c) vs. die size and dissipating area
2) Rth(j-a) vs on board heat sink area
3) Zth(j-a) vs time width and die size
February 1998
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