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KBPC1510L Datasheet, PDF (1/2 Pages) List of Unclassifed Manufacturers – IN - LINE SINGLE - PHASE SILICON BRIDGE RECTIFIER VOLTAGE - 50 TO 1000 VOLTS CURRENT - 15.0 AMPERES
RS
KBPC15005L THRU KBPC1510L
IN - LINE SINGLE - PHASE SILICON BRIDGE RECTIFIER
VOLTAGE - 50 TO 1000 VOLTS CURRENT - 15.0 AMPERES
C
A
D
AC
B
J
H
GE
KBPC-L
Dim Min Max
A 28.45 28.70
B 19.05
C 13.97
D 5.10
E 10.97 11.23
G 1.02
H 3.05 3.60
Metal heat sink
J epoxy case
All Dimensions in mm
FEATURES
Surge overload rating - 300 amperes peak
Integrally molded heat-sink provide very low thermal
resistance for maximum heat dissipation.
Universal 3 way terminals: snap-on, wire wrap-around,
or P.C. board mounting.
Plastic package used has Underwriters Laboratory
Flammability Classification 94V-0
High temperature soldering guaranteed:
260OC/10 seconds at 5lbs. (2.3kg) tension
MECHANICAL DATA
Case: Molded plastic with heatsink integrally mounted
in the bridge encapsulation
Terminals: wire lead 50 mils.
Weight: 0.65 ounce, 18 grams
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25OC ambient temperature unless otherwise specified
Sing phase half-wave 60HZ, resistive or inductive load
For capacitive load, derate current by 20%
Maximum Repetitive Peak Reverse Voltage
Maximum RMS Voltage
Maximum DC Blocking Voltage
Maximum Average Forward Rectified Current
TA = 55OC
Peak Forward Surge Current 8.3ms Single
Half Sine-Wave Superimposed on Rated Load
SYMBOL
KBPC
15005L
KBPC
1501L
KBPC
1502L
KBPC
1504L
KBPC
1506L
KBPC
1508L
KBPC
1510L
VRRM 50 100 200 400 600 800 1000
VRMS
35
70 140 280 420 560 700
VDC 50 100 200 400 600 800 1000
I(AV)
15.0
IFSM
300
UNITS
Volts
Volts
Volts
Amps
Amps
Maximum Instantaneous Forward Voltage
Drop Per Bridge Element at 7.5A
VF
Maximum DC Reverse Current TA = 25 OC
at Rated DC Blocking Voltage TA = 125 OC
IR
1.2
Volts
10
A
500
Rating for fusing (t < 8.3ms)
I2t
375
Typical Junction Capacitance (NOTE 1)
CJ
300
Typical Thermal Resistance (NOTE 2)
R JC
6.3
Operating and Storage Temperature Range
TJ, TSTG
-55 to + 150
NOTES:
1. Measured at 1.0MHz and applied reverse voltage of 4.0 volts
2. Thermal resistance from junction to case per bridge element
3. Bolt down on heatsink with silicon thermal compound between bridge and mounting surface
for maximum heat transfer efficiency with #10 screw
A2s
pF
oC/W
oC