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| IBR-I7-R-3517UE Datasheet, PDF (1/3 Pages) List of Unclassifed Manufacturers – Extreme Rugged™ COM Express® Type 6 Module with 3rd Generation Intel® Core™ i3/i7 Processor | |||
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Express-IBR
Extreme Rugged⢠COM Express® Type 6 Module with
3rd Generation Intel® Core⢠i3/i7 Processor
Features
Quad/dual core 3rd Generation Intel® Coreâ¢
Processor
Mobile Intel® QM77 Express Chipset
Up to 16GB ECC 1600MHz DDR3 memory in two
SODIMM sockets
Three Digital Display Interfaces (DDI) for
DisplayPort /HDMI/DVI/SDVO
Seven PCIe x1 (Gen 2), one PCIe x16 (Gen 3) for
graphics (or general purpose x8/4/1)
2x SATA 6 Gb/s, 2x SATA 3 Gb/s, Gigabit Ethernet,
USB 2.0, 4 USB 3.0
COM Express® COM.0 R2.1 Type 6 Pinout
Extended Temperature: -40°C to +85°C
50% Thicker PCB for high vibration environments
Specifications
Core System
CPU
Memory
BIOS
Hardware Monitor
Debug Interface
Watchdog Timer
Expansion Busses
Technologies
3rd Generation Intel® Core⢠i7/i3, 22nm process, BGA type
Intel® Core⢠i7-3615QE 2.3GHz (up to 3.3GHz Turbo), 6MB
L3 cache, 45W, quad core
Intel® Core⢠i7-3612QE 2.1GHz (up to 3.1GHz Turbo), 6MB
L3 cache, 35W, quad core
Intel® Core⢠i7-3555LE 2.5GHz (up to 3.2GHz Turbo), 4MB
L3 cache, 25W, dual core
Intel® Core⢠i7-3517UE 1.7GHz (up to 2.8GHz Turbo), 4MB
L3 cache, 17W, dual core
Intel® Core⢠i3-3217UE 1.6GHz, 3MB
L3 cache, 17W, dual core
Dual channel ECC 1600 MHz DDR3 memory up to 16 GB in
dual SODIMM sockets
AMI EFI with CMOS backup in 16 Mb SPI flash
Supply voltages and CPU temperature
XDP SFF-26 extension for ICE debug
Programmable timer range to generate RESET
PCI Express x16 (Gen3) bus for discrete graphics solution or
general purpose PCI Express (2 x8 or 1 x8 with 2 x4)
7 PCI Express x1: Lanes 0/1/2/3/4/5/6
LPC bus, SMBus (system), I2C (user)
PAVP 3.0, Intel® AMT 8.0, Intel® VT, Intel® AES-NI, Intel® HT,
Intel® HD Graphics with Dynamic Frequency, Intel® Turbo
Boost , Dynamic Turbo, Intel® AVX 1.0, Intel® Quick Sync Video
Video
Integrated in Processor Intel® HD Graphics 4000 at 650-1300 MHz
Integrated Video
DirectX 11.0, OpenGL 3.1, and OCL 1.1
Media Processing
Decode (HW JPEG & MJPEG decode), encode (full HW
MPEG2 encode), transcode
Intel® Clear Video HD Technology + enhanced media
processing
VGA Interface
Analog VGA support with 300 MHz DAC
Analog monitor support up to QXGA (2048 x 1536) and VGA
hot plug
LVDS Interface
Dual channel 18/24-bit LVDS
Digital Display Interface Three DDI ports supporting HDMI / DVI / DisplayPort or SDVO
Audio
Chipset
Audio Codec
Integrated on Mobile Intel® QM77 Express chipset
Implemented on carrier board
Ethernet
Chipset
Speed
Intel® Gigabit LAN PHY WG82579LM
10/100/1000 Mbps Ethernet
Multi I/O
Chipset
USB
SATA
Integrated on Mobile Intel® QM77 Express chipset
Supports up to eight ports USB 2.0, 4 USB 3.0
Two SATA 6 Gb/s, two SATA 3 Gb/s with support for RAID
0,1,5,10
Super I/O
Connected to LPC bus on carrier if needed (BIOS supports
W83627DHG)
TPM (optional)
Chipset
Type
Atmel AT97SC3204-U1A190
TPM 1.2
Power
Input Power
Power States
Power Consumption
Smart Battery Support
AT mode (12 V +/- 5%) and ATX mode
(12 V and 5 Vsb +/- 5%)
Supports S0, S1, S3, S4, S5
12W typical (i7-36xxQE)
8W typical (i7-3555LE/i7-3517UE/i3-3217UE)
S3: 0.85W
S5: 0.55W
Yes (BIOS supports LTC4100 and LTC1760)
Mechanical and Environmental
Size
Board Thickness
Operating Temperature
Storage Temperature
Humidity
Shock
Vibration
Compatibility
Certifications
COM Express Basic, 125 mm x 95 mm
0.093â (2.3mm)
Standard: -20°C to 70°C
Extended: -40°C to 85°C
-55°C to 85°C
90% at 60°C non-condensing
50G peak-to-peak, 11ms duration, MIL-STD-202G Method
213B
Operating: 11.96 Grms, 50-20,000 Hz, each axis,
MIL-STD-202G Method 214A
PICMG COM Express COM.0 R2.1 Type 6
CE, FCC, HALT
Operating Systems
Standard Support
Windows 7
Linux
Extended Support (BSP) Windows XPe/7, WEC 7
Linux, VxWorks 6.9, QNX 6.5
AIDI Library
17
http://www.adlinktech.com/Computer-on-Module
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