CN34JTN103 Datasheet, PDF (5/11 Pages) List of Unclassifed Manufacturers – Thick Film Chip Resistor Networks

Thick Film Chip Resistor Arrays
Thick Film Chip Resistor Networks
(Lead-Free for CN Series Standard)
Halogen-Free
Document No. TCN-XX0S001R
Revise Date
2012/11/07
page number
5 /11
5. Reliability Tests:
Test Items
Reference
standard
Condition of Test
Test Limits (△R )
Temperature Coefficient
of Resistance
IEC60115-1-4.8
JIS-C5201-1-4.8
-55〜 +125 ℃
Refer 4.0
Short Time Overload
IEC60115-1-4.13
JIS-C5201-1-4.13
2.5 X rated voltage for 5 sec
±(2.0%+0.1Ω)
0Ω : 50 mΩ or less
Intermittent Overload
±(5.0%+0.1Ω)
IEC60115-1-4.39 2.5X rated voltage or Max Overloading Voltage ,
JIS-C5201-1-4.39 1 sec “ON” 25 sec “OFF” , 10000 cycles
0Ω : 50mΩ or less
Load Life
IEC60115-1-4.25.1 1000 hours at rated voltage , 70℃ , 1.5hours
JIS-C5201-1-4.25.1 “ON “, 0.5hour “OFF”
1%:±(1.0%+0.05Ω)
5%:±(3.0%+0.1Ω)
0Ω :100 mΩ or less
Load Life with Humidity
IEC60115-1-4.24 1000 hours at rated voltage , 40±2℃,
JIS-C5201-1-4.24 90~95% RH 1.5hours “ON “, 0.5hour “OFF”
1%:±(1.0%+0.05Ω)
5%:±(3.0%+0.1Ω)
0Ω :100 mΩ or less
Rapid Change of Temperature
IEC60115-1-4.19
JIS-C5201-1-4.19
-55℃ (30 min. ) / +155 ℃(30 min. ) 5 cycles
1%:±(0.5%+0.05Ω)
5%:±(1.0%+0.05Ω)
0Ω :50 mΩ or less
Solderability
IEC60115-1-4.17 245±5℃ solder, 2±0.5 sec dwell.
JIS-C5201-1-4.17 Solder : Sn96.5 / Ag3.0 / Cu0.5
At least 95% of surface area
of electrode shall be covered
with new solder.
Core body
IEC60115-1-4.15
JIS-C5201-1-4.15
Pressure 1.0 kgf a R0.5 pressure rod for 10 sec
Without mechanical damage
such as breaks. Electrical
characteristics shall be satisfied
Dielectric
Withstanding
Voltage (Voltage Proof)
IEC60115-1-4.7
JIS-C5201-1-4.7
Applying voltage 100V for 1 minute.
Resistance to Solder Heat
IEC60115-1-4.18
JIS-C5201-1-4.18
270 ±5℃ solder , 10 ±1 sec dwell .
Note* : RCWV : Rated continuous working voltage .
No abnormalities such as
flashover, burning dielectric
breakdown shall appear.
0.5%,1%:±(1.0%+0.05Ω)
2%,5%:±(2.0%+0.1Ω)
0Ω : 50mΩ or less
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