SKQGAEE010 Datasheet, PDF (4/5 Pages) List of Unclassifed Manufacturers – TACT SwitchTM 5.2X5.2mm Low-profile (SMD)Type

TACT Switch^TM
Soldering Conditions
Detector
Push
Slide
Condition for Reflow
Available for Surface Mount Type.ʢExcept SKRM, SKRR Seriesʣ
1. Heating method: Double heating method with infrared heater.
2. Temperature measurement: Thermocouple 0.1 to 0.2П CAʢKʣor CCʢTʣat soldering portionʢcopper foil surfaceʣ. A heat resisting tape
should be used for fixed measurement.
3. Temperature profile
Temperature (˚C )
260˚C max. 3 sec max.
Rotary
180
Encoders
150
230˚C
Power
Dual-in-line
Package Type
Multi Control
Devices
TACT Switch^TM
Custom-
Products
Time

TFD
NBYÊ¢ QSFIFBUJOH
Ê£

40s max.
3 to 4min.
Time inside soldering equipment
Note
1. The condition mentioned above is the temperature on the mounting surface of a PC board. There are cases where
the PC board's temperature greatly differs from that of the switch, depending on the PC board's material, size,
thickness, etc. The above-stated conditions shall also apply to switch surface temperatures.
2. Soldering conditions differ depending on reflow soldering machines. You are requested to verify the soldering
conditions thoroughly beforehand.
Sharp
Feeling
Soft
Feeling
Snap-in
Type
Conditions for Auto-dip
Available for Snap-in Type and Radial Type
ʢExcept SKHJ, SKHL, SKQC, SKQJ, SKQK, SKEG seriesʣ
Items
Condition
Surface
Mount Type
Radial
Type
Flux built-up
Mounting surface
should not be coated with flax
Ambient temperature of the soldered
Preheating temperature
surface of PC board.
100ˆ max.
Preheating time
60s max.
Soldering temperature
260ˆ max.
Continuous dipping time
5s max.
Number of soldering
2times max.
Manual Soldering (Except SKRT series)
Items
Condition
Soldering temperature
Continuous soldering time
capacity of soldering iron
350ˆmax.
3s max.
60W max.
Notes
1. Consult with us for TACT Switch^TM washing conditions.
2. Prevent flux penetration from the top side of the TACT Switch^TM.
3. Switch terminals and a PC board should not be coated with flux prior to soldering.
4. The second soldering should be done after the switch returns to normal temperature.
5. Use the flux with a specific gravity of at least 0.81.
Ê¢EC-19S-8 by TAMURA Corporation, or their equivalents.Ê£
370