NSSW440TVR Datasheet, PDF (4/11 Pages) List of Unclassifed Manufacturers – SPECIFICATIONS FOR NICHIA CHIP TYPE WHITE LED

Nichia STCE-CS0010B
<Cat.No.010307>
7.CAUTIONS
White LEDs are devices which are materialized by combining Blue LEDs and special phosphors.
Consequently, the color of White LEDs is changed a little by an operating current.
Care should be taken after due consideration when using LEDs.
(1) Moisture Proof Package
ŋ When moisture is absorbed into the SMT package it may vaporize and expand during soldering.
There is a possibility that this can cause the exfoliation of the contacts and the damage the optical
characteristics of the LEDs. For this reason, the moisture proof package is used to keep moisture
to a minimum in the package.
ŋ After opening the package, the LEDs should be kept at 30ˆ, 70%RH or less.
The LEDs should be soldered within 168 hours (7days) after opening the package.
ŋ When storing the LEDs after opening the package, use a sealable away from package with a moisture
absorbent material inside.
ŋ If the blue color of the desiccant indicator has faded after storing, a baking treatment should be
performed as follows : 65ʶ5ˆ for more than 24 hours
(2) Soldering Conditions
ŋ The LEDs can be soldered in place using the reflow soldering method.
Nichia cannot guarantee the LEDs after they have been assembled using the solder dipping method.
ŋ The recommended soldering conditions are as follows :
ʲHand Solderingʳ
Soldering iron : 300ˆ Max. 3 seconds (one time only)
A soldering iron with a 20W Max. only must be used.
ʲReflow Solderingʳ
ʲTemperature-Profileʳ
Use the conditions shown to the right figure.
Pre-heatingɿ 120ʙ150ˆ 120 seconds Max.
Soldering ɿ 240ˆ Max. 5 seconds Max.
(Rapid cooling should be avoided.)
2.5ʙ5ˆösec.ç
2.5ʙ5ˆösec.ç
240ˆ
Pre-heating
5sec.
120ʙ150ˆ _40sec.Max.
Above 200ˆç
Max.
Max.
ŋ Recommended installation pattern
120sec.Max.
2.3 1.0 2.3
5.6
ŋ When using the chip mounter, it is possibly happens that handling LEDs is difficult in accordance with
the machine. For the purpose to ensure this will not cause trouble, pre-test should be performed by
using the production machine.
ŋ Modifications should not be done after the LEDs have been soldered.
If modifications cannot be avoided, a double-head soldering iron should be used after checking
whether the characteristics of the LEDs will not be damaged by modification after soldering.
ŋ Reflow soldering should not be done more than once.
ŋ When soldering, do not apply force to the package during heating.
ŋ After soldering, do not warp the circuit board.
(3) Cleaning
ŋ Use Isopropyl Alcohol as a solvent for cleaning the LEDs. Using other solvents may dissolve
the LED package and the epoxy. Caution is needed.
ŋ Ultrasonic cleaning of the LEDs should not be done.
-3-