MLX90316_05 Datasheet, PDF (4/34 Pages) List of Unclassifed Manufacturers – Rotary Position Sensor IC

MLX90316
Rotary Position Sensor IC
14.6. LOCK.........................................................................................................................................................18
14.6.1. MLXLOCK Parameter .........................................................................................................................18
14.6.2. LOCK Parameter .................................................................................................................................18
15. MLX90316 SELF DIAGNOSTIC.......................................................................................................... 19
16. SERIAL PROTOCOL........................................................................................................................... 21
16.1. INTRODUCTION .........................................................................................................................................21
16.2. SERIAL PROTOCOL MODE ...................................................................................................................21
16.3. MOSI (MASTER OUT SLAVE IN) ...............................................................................................................21
16.4. MISO (MASTER IN SLAVE OUT) ...............................................................................................................21
16.5. /SS (SLAVE SELECT) .................................................................................................................................21
16.6. MASTER START-UP ...................................................................................................................................21
16.7. SLAVE START-UP ......................................................................................................................................21
16.8. TIMING......................................................................................................................................................22
16.9. SLAVE RESET ............................................................................................................................................23
16.10. FRAME LAYER ..........................................................................................................................................23
16.10.1. Command Device Mechanism ..........................................................................................................23
16.10.2. Data Frame Structure ......................................................................................................................23
16.10.3. Timing ..............................................................................................................................................23
16.10.4. Data Structure ..................................................................................................................................24
16.10.5. Angle Calculation.............................................................................................................................24
16.10.6. Error Handling.................................................................................................................................24
17. RECOMMENDED APPLICATION DIAGRAMS .................................................................................. 25
17.1.
17.2.
17.3.
17.4.
ANALOG OUTPUT WIRING WITH THE MLX90316 IN SOIC PACKAGE.......................................................25
ANALOG OUTPUT WIRING WITH THE MLX90316 IN TSSOP PACKAGE....................................................25
PWM LOW SIDE OUTPUT WIRING ............................................................................................................26
SERIAL PROTOCOL ....................................................................................................................................26
18. STANDARD INFORMATION REGARDING MANUFACTURABILITY OF MELEXIS PRODUCTS
WITH DIFFERENT SOLDERING PROCESSES ........................................................................................ 28
19. ESD PRECAUTIONS........................................................................................................................... 28
20. PACKAGE INFORMATION................................................................................................................. 29
20.1.
20.2.
20.3.
20.4.
20.5.
20.6.
SOIC8 - PACKAGE DIMENSIONS ...............................................................................................................29
SOIC8 - PINOUT AND MARKING ...............................................................................................................29
SOIC8 - IMC POSITIONNING.....................................................................................................................30
TSSOP16 - PACKAGE DIMENSIONS...........................................................................................................31
TSSOP16 - PINOUT AND MARKING ..........................................................................................................32
TSSOP16 - IMC POSITIONNING................................................................................................................32
21. DISCLAIMER ....................................................................................................................................... 34
3901090316
Rev. 001
Page 4 of 34
Data Sheet
4 October 05