CT06V5TR20 Datasheet, PDF (4/6 Pages) List of Unclassifed Manufacturers – Surface Mount Fuse

Surface Mount Fuse
(Thin Film Chip Fuse)
Pb _RoHS
8. Reliability Tests
Document No TCT-060S001A
Issued date
2014/02/25
Page
4/6
Parameter
Requirement
Test Method
Reference Standard
Carrying capacity No fusing
Rated current ,4hr
Fusing Time Within 2 minute
200% of its rated current
Without
permanent _{The rated voltage of the fuse and shall}
Breaking capacity ^arcing、 be maintained for 30 s after the fuse
ignition、 has operated.
bursting of fuse
Insulation
Resistance
0.1MΩ and
more
Measure with DC twice the rated
voltage after breaking capacity
Bending Test
Resistance to
solder Heat
Solderability
No mechanical
damages
∣△ R∣＜20%
95% coverage
minimum
Distance between holding points:
90mm, Bending:3mm,1time ,30sec
260℃±5℃,10±1second
235℃±5℃, 2±0.2second
(Solder : Sn96.5 / Ag3.0 / Cu0.5)
Temperature Rise △ T<70℃
125% of its rated current, Measure of
surface temperature rise
Resistance to Dry
Heat
∣△ R∣＜20%
155℃±5℃,96 hrs
No evident
Resistance to
Solvent
damages on 15 s with a piece of cloth soaked in
protective water and again for 15 s with a piece of
coating and
cloth soaked in petroleum spirit.
marking
Thermal Shock ∣△ R∣＜10% -55℃/+25℃/+155℃/+25℃, 10 cycles
UL248-14
IEC60127-4-9.2.1
IEC60127-1
IEC60127-4-9.3.1
IEC60127-4-9.3.3
IEC60115-1-4.33
IEC60028-2-58
IEC60028-2-58
IEC60127-4-9.7
IEC60115-1-4.23.2
JIS C5201-1-4.23.2
IEC60127-1-6.2
MIL-STD 202-107G
Humidity
∣△ R∣＜20%
40±2°C/90~95%RH,1000 hrs
MIL-STD-202G
Method 103B
9. Storage Conditions:
Temperature: 5℃~35℃,Humidity:40%~75%
10. Shelf Life:
2 years from manufacturing date
TA-I TECHNOLOGY CO., LTD