CP04V3TR50 Datasheet, PDF (4/17 Pages) List of Unclassifed Manufacturers – Thin Film Chip Fuse

Thin Film Chip Fuse
Document No TCP-XXOS006H
Issued date
2012/06/28
Page
4/17
6.Temperatuer Derating Curve
6.1 Normal Ambient Temperature: 25℃
6.2 Operating Temperature: -20℃~105℃,whit proper Derating factor as below:
105
7.Reliability Tests
Parameter
Requirement
Test Method
Carrying capacity
Fusing Time
Interrupting Ability
Bending Test
Resistance to solder Heat
Solderability
No fusing
Within 5sec.
No mechanical
damages
No mechanical
damages
±20%
95% coverage
minimum
Temperature Rise
<75℃
Resistance to Dry Heat
Resistance to Solvent
Residual Resistance
Thermal Shock
±20%
No evident damages
on protective coating
and marking
10kΩ and more
△R< 10 %
Rated current ,4hr
200% of its rated current
After the fuse is interrupted ,rated voltage applied for
30sec again
Distance between holding points: 90mm,
Bending:3mm,1time ,30sec
260℃±5℃,10seconds ±1second
235℃±5℃, 2±0.5second
245℃±5℃, 2±0.5second (Lead Free)
100% of its rated current, Measure of surface
temperature
105℃±5℃,1000 hrs
23℃±5℃of Isopropyl alcohol 90second
Measure DC resistance after fusing
-20℃/ +25℃/+125℃/+25℃ , 10 cycles
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