CA06P4S17ALCGK2 Datasheet, PDF (4/6 Pages) List of Unclassifed Manufacturers – SMD Multilayer Varistor Array with AgPt Termination

Metal Oxide Varistor
SMD Multilayer Varistor Array with AgPt Termination
Data sheet
Recommended Geometry of Solder Pads
A = 0,5 mm
B = 0,7 mm
C = 1,2 mm
E = 0,76 mm
E
A
B
C
CA06P4S17ALCGK2
B72728A2170S162
Recommended Soldering Temperature Profiles
300
°C
250
T
200
ca. 225 °C
180 °C
150
ca. 40 s
ca. 100 s
100
50
0
0
max 2°C/s
50
100
150
200 s 250
t
This component is only suited for IR-soldering at relatively low temperatures and must not be
wave soldered because of dissolution of the metallization!
Max. reflow temperature: 235° C, 30 sec
220° C, 45 sec.
Max. reflow cycles:
2x.
As far as possible, the components shall be employed within 6 months. They should be left in
their original packings to avoid soldering problems due to oxidized contacts.
Storage temperature: -25 to 45°C
Relative humidity: <75% annual average, <95% on max. 30 days in a year.
The usage of mild, non activated fluxes for soldering is recommended, as well as a proper
cleaning of the PCB.
ISSUE DATE
12.07.02
ISSUE
e
PUBLISHER
KB VS PE
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