GS816136T-166I Datasheet, PDF (37/40 Pages) List of Unclassifed Manufacturers – 165 Bump BGA-x18 Commom I/O - Top View (Package D)

GS816118/36T-250/225/200/166/150/133
TQFP Package Drawing
Symbol Description
Min. Nom. Max
θ
L
c
L1
A1
Standoff
0.05 0.10 0.15
A2
Body Thickness 1.35 1.40 1.45
b
Lead Width
0.20 0.30 0.40
c
Lead Thickness 0.09
0.20
D Terminal Dimension 21.9 22.0 22.1
e
D1
Package Body 19.9 20.0 20.1
E
Terminal Dimension 15.9 16.0 16.1
b
E1
Package Body 13.9 14.0 14.1
e
Lead Pitch
0.65
L
Foot Length
0.45 0.60 0.75
L1
Lead Length
1.00
A1
Y
Coplanarity
0.10
A2
E1
θ
Lead Angle
0°
7°
E
Notes:
1. All dimensions are in millimeters (mm).
2. Package width and length do not include mold protrusion.
Rev: 2.12 9/2002
29/32
© 1999, Giga Semiconductor, Inc.
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.