MC33196 Datasheet, PDF (3/4 Pages) List of Unclassifed Manufacturers – Resettable Fuse

Resettable Fuse
Material Specification
Terminal Pad Material : Pure Tin
Soldering Characteristics : Meets EIA specification RS 186-9E, ANSI/J-std-002 Category 3
Pad Layouts, Solder Reflow and Rework Recommendations
The dimension in the table below provide the recommended pad layout for each FSMD1812 device
Device
All 1206 Series
A
Nominal
2
B
Nominal
1
C
Nominal
1.9
Dimensions : Millimetres
Profile Feature
Average Ramp-Up Rate (Tsmax to Tp)
Preheat :
Temperature Minimum (Tsmin)
Temperature Maximum (Tsmax)
Time (tsmin to tsmax)
Time maintained above:
Temperature(TL)
Time (tL)
Peak/Classification Temperature(Tp)
Time within 5°C of actual Peak
Temperature (tp)
Ramp-Down Rate :
Time 25°C to Peak Temperature :
Pb-Free Assembly
3°C/second maximum
150°C
200°C
60-180 seconds
217°C
60-150 seconds
260°C
20-40 seconds
6°C/second maximum
8 minutes maximum
Note 1: All temperatures refer to of the package, measured on the
package body surface
Solder Reflow:
Due to “Lead Free” nature, Temperature and Dwelling time for the soldering damage to other components.
1. Recommended max past thickness > 0.25mm.
2. Devices can be cleaned using standard methods and aqueous solvent.
3. Rework use standard industry practices.
4. Storage Environment : < 30°C / 60% RH
Caution:
1. If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.
2. Devices are not designed to be wave soldered to the bottom side of the board.
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11/10/12 V1.0