201R15C Datasheet, PDF (3/5 Pages) List of Unclassifed Manufacturers – C-SERIES HIGH FREQUENCY CHIP CAPACITORS

DIELECTRIC CHARACTERISTICS
TEMPERATURE COEFFICIENT:
QUALITY FACTOR:
INSULATION RESISTANCE:
DIELECTRIC STRENGTH:
TEST PARAMETERS:
AVAILABLE CAPACITANCE:
0 ± 30ppm /°C, -55 to 125°C
2,500 min.,10,000 typical
>1,000 GΩ @ 25°C,WVDC;
125°C IR is 10% of 25°C rating.
2.5 X WVDC Min., 25°C, 50 mA max
1MHz ±50kHz, 1.0±0.2 VRMS, 25°C
Size 0402:
Size 0603:
Size 0805:
Size 1210:
0.2 - 15 pF
0.2 - 47 pF
0.2 - 150 pF
0.5 - 1000 pF
Typical Series Resonant Frequency
10.0
R07/0402
R14/0603
R15/0805
1.0
0.8
1
10
Capacitance (pF)
100 200
MECHANICAL & ENVIRONMENTAL CHARACTERISTICS
SOLDERABILITY:
SPECIFICATION
Solder coverage ≥ 90% of
metalized areas
RESISTANCE TO
SOLDERING HEAT:
Chip should not crack.
Solder coverage ≥ 80%
TERMINAL
ADHESION:
PCB DEFLECTION:
LIFE TEST:
THERMAL SHOCK:
MOISTURE
RESISTANCE:
Termination should not pull off.
Ceramic should remain undamaged.
No mechanical damage.
Cap. change: 2% or .5pF Max
Cap. change: 2% or .5pF Max
I.R. = Initial value
Cap. change: 2% or .5pF Max
I.R. = 70% of initial value
Cap. change: 2% or .5pF Max
I.R. = 70% of initial value
TEST PARAMETERS
Preheat chip to 120°-150°C for 60 sec.
Dip terminals in rosin flux then dip in
62Sn/36Pb/2Ag solder @ 240±5°C
Dip time = 5±1 sec.
Preheat chip to 120°-150°C for 60 sec.
Dip terminals in rosin flux then dip in
62Sn/36Pb/2Ag solder @ 260±5°C
Dip time = 10±1 sec.
Linear pull force exerted on axial leads soldered
to each terminal. Terminal strength: For 0402:
≥2.0Lbs For 0603: ≥2.0Lbs For 0805:≥5.0Lbs
Glass Epoxy PCB: 1 mm deflection
1000 Hours, 125°C, 200% rated voltage
5 CYCLES: 30±3 minutes @ -55°C, 3 min.@25°C
30±3 min. @ +125°C, 3 min. @ 25°C
240 Hours, 85% Relative Humidity, 85°C, 1.5 VDC
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