ISZ-650 Datasheet, PDF (21/24 Pages) List of Unclassifed Manufacturers – Single-Axis Z-Gyro Product Specification

ISZ-650 Single-Axis Z-Gyroscope
Product Specification
PS-ISZ-0650B-00-02
Release Date: 07/08/09
9.13 Reflow Specification
The approved solder reflow curve shown in the figure below conforms to IPC/JEDEC J-STD-020D.01
(Moisture/Reflow Sensitivity Classification for Non hermetic Solid State Surface Mount Devices) with a
maximum peak temperature (Tc = 260°C). This is specified for component-supplier reliability qualification
testing using lead-free solder for package thicknesses less than 1.6 mm. The reliability qualification pre-
conditioning used by InvenSense incorporates three of these conforming reflow cycles. All temperatures
refer to the topside of the QFN package, as measured on the package body surface. Customer solder-reflow
processes should use the solder manufacturer’s recommendations, making sure to never exceed the
constraints listed in the table and figure below, as these represent the maximum tolerable ratings for the
device. For optimum results, production solder reflow processes should use lower temperatures, reduced
exposure times to high temperatures, and lower ramp-up and ramp-down rates than those listed below.
Approved IR/Convection Solder Reflow Curve
Temperature Set Points for IR / Convection Reflow Corresponding to Figure Above
Step
A
B
C
D
E
F
G
H
I
Setting
T_room
T_Smin
T_Smax
T_Liquidus
T_Pmin
[≤TPmax-5˚C,255°C]
T_{Pmax [260°C]}
T_Pmin
T_Liquidus
T_room
Temp (°C)
25
150
200
217
255
260 -0/+5°C
255
217
25
CONSTRAINTS
Time (sec)
Rate (°C/sec)
60 < t_BC < 120
t_AF < 480
t_EG < 30
60 < t_DH < 120
r_(TL-TPmax) < 3
r_(TL-TPmax) < 3
r_(TL-TPmax) < 3
r_(TPmax-TL) < 6
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