HPW7095 Datasheet, PDF (21/23 Pages) List of Unclassifed Manufacturers – 6-Channel DC/DC Converter Control IC

HPW7095/A
Physical Specifications
Terminal Material
Lead Solderability
Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb), 100%Sn
Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3.
Reflow Condition (IR/Convection or VPR Reflow)
T_P
tp
Critical Zone
R am p-up
T_L to T_P
T_L
t_L
Tsmax
Tsm in
ts
Preheat
R am p-down
25
t 25 ^°C to Peak
Classificatin Reflow Profiles
T im e
Profile Feature
Sn-Pb Eutectic Assembly
Large Body
Small Body
Pb-Free Assembly
Large Body
Small Body
Average ramp-up rate
(T_L to T_P)
Preheat
- Temperature Min (Tsmin)
- Temperature Mix (Tsmax)
- Time (min to max)(ts)
3°C/second max.
100°C
150°C
60-120 seconds
3°C/second max.
150°C
200°C
60-180 seconds
Tsmax to T_L
- Ramp-up Rate
3°C/second max
Tsmax to T_L
- Temperature(T_L)
- Time (t_L)
183°C
60-150 seconds
217°C
60-150 seconds
Peak Temperature(Tp)
225 +0/-5°C
240 +0/-5°C
245 +0/-5°C 250 +0/-5°C
Time within 5°C of actual Peak
Temperature(tp)
10-30 seconds
10-30 seconds
10-30 seconds 20-40 seconds
Ramp-down Rate
6°C/second max.
6°C/second max.
Time 25°C to Peak Temperature
6 minutes max.
8 minutes max.
Note: All temperatures refer to topside of the package. Measured on the body surface.
 Copyright HIPAC Semiconductor, Inc.
21
Rev. A.2 - July., 2004
www.hipacsemi.com