MSK3017 Datasheet, PDF (2/5 Pages) M.S. Kennedy Corporation – THREE PHASE BRIDGE MOSFET POWER MODULE

ABSOLUTE MAXIMUM RATINGS
VDSS
VDGDR
VGS
ID
IDM
RTH-JC
RTH-JC
Drain to Source Voltage ○ ○ ○ ○ 200V MAX
Drain to Gate Voltage
(R =1MΩ) 200V MAX GS
○
○
○
○
○
○
○
○
○
○
○
Gate to Source Voltage
(Continuous)
±20V MAX ○
○
○
○
○
○
○
○
○
○
Continuous Current ○ ○ ○ ○ ○ ○ ○ 30A MAX
Pulsed Current ○ ○ ○ ○ ○ ○ ○ ○ ○ ○ 46A MAX
Thermal Resistance
(Junction to Case)@25°C ○ ○ ○ ○ ○ 1.0°C/W
Thermal Resistance
(Junction to Case)@125°C ○ ○ ○ ○ 1.6°C/W
Single Pulse Avalanche Energy
○
○
○
○
○
○
○
○
○1000 mJ
TJ Junction Temperature
+150°C MAX
○
○
○
○
○
○
○
○
○
○
○
○
TST Storage Temperature ○ ○ ○ ○ ○ ○ ○ ○ ○ -55°C to +150°C
TC Case Operating Temperature Range -55°C to +125°C
TLD Lead Temperature Range
(10 Seconds) 300°C MAX ○
○
○
○
○
○
○
○
○
○
○
○
○
○
○
○
○
ELECTRICAL SPECIFICATIONS
Parameter
Drain-Source Breakdown Voltage
Drain-Source Leakage Current
Gate-Source Leakage Current
Gate-Source Threshold Voltage
Drain-Source On Resistance 2
Drain-Source On Resistance 3
Forward Transconductance 1
Total Gate Charge 1
Gate-Source Charge 1
Gate-Drain Charge 1
Turn-On Delay Time ¹
Rise Time 1
Turn-Off Delay Time 1
Fall Time 1
Input Capacitance 1
Output Capacitance ¹
Reverse Transfer Capacitance 1
Body Diode
Forward On Voltage 1
Reverse Recovery Time 1
Reverse Recovery Charge 1
Test Conditions 4
VGS=0 ID=0.25mA
VDS=200V VGS=0V
VGS=±20V VDS=0
VDS=VGS ID=250µA
VGS=10V ID = 30A
VGS=10V ID=30A
VDS=50V ID=30A
ID = 30A
VDS=160V
VGS = 10V
VDD=100V
ID = 30A
RG = 4.3Ω
RD = 2.1Ω
VGS=0V
VDS=25V
f=1MHz
IS=30 A VGS=0V
IS=30 A di/dt=100A/µS
Min.
200
-
-
2.0
-
-
24
-
-
-
-
-
-
-
-
-
-
-
-
-
MSK3017
Typ.
-
-
-
-
-
-
-
-
-
-
23
120
100
94
5200
1200
310
1.8
390
4.8
Max.
-
250
±100
4.0
0.09
0.06
-
230
42
110
-
-
-
-
-
-
-
-
590
7.2
Units
V
µA
nA
V
Ω
Ω
S
nC
nC
nC
nS
nS
nS
nS
pF
pF
pF
V
nS
µC
NOTES:
1 This parameter is guaranteed by design but need not be tested. Typical parameters are representative of actual device performance but are for reference only.
2 Resistance as seen at package pins.
3 Resistance for die only; use for thermal calculations.
4 TA=25°C unless otherwise specified.
2
Rev. - 8/01