LRF2512-R025FW Datasheet, PDF (2/2 Pages) List of Unclassifed Manufacturers – Low Value Flat Chip Resistor

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Welwyn Components
Dimensions (mm)
LR1206
LR2010
LR2512
A
2.0
3.05
3.7
B
4.0
6.5
7.75
C
1.25
1.5
1.5
A
B
C
AEC-Q200 Table 7
ref
Test
Method
3
High Temp. Exposure MIL-STD-202 Method 108
4
Temperature Cycling JESD22 Method JA-104
6
Moisture Resistance MIL-STD-202 Method 106
7
Biased Humidity MIL-STD-202 Method 103
8 Operational Life (Cyclic Load) MIL-STD-202 Method 108
14
Vibration MIL-STD-202 Method 204
15 Resistance to Soldering Heat MIL-STD-202 Method 210
16
Thermal Shock MIL-STD-202 Method 107
18
Solderability
J-STD-002
21
Board Flex
AEC-Q200-005
22
Terminal Strength
AEC-Q200-006
Short Term Overload
6.25 x Pr for 2s
Low Temperature Storage -65°C for 100 hours
Leach Resistance Solder dip at 250°C
Max. Typ.
(add R05) (@1R0)
R% 0.5 0.2
R% 0.25 0.1
R% 0.5 0.2
R% 0.5 0.2
R% 1 0.5
R% 0.5 0.05
R% 0.25 0.05
R% 0.25 0.1
>95% coverage
R% 0.5 0.2
R% 0.25 0.1
R% 0.5
R% 0.5
90s minimum
(%)
100
80
60
40
20
0
25
70
150 (°C)
Ambient temperature
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Note:
1. Although 2010 and 2512 sizes have passed temperature cycling and thermal shock, it is in general not recommended that ceramic
chips this large be used on FR4 in a severe temperature cycle environment due to the possibility of solder joint fatigue.
2. Full AEC-Q200 qualification applies to ohmic values ≥R01.
Ordering Procedure
Example: LRF2512 at 10 milliohms (hence flip-chip mounted) and 2% tolerance on a reel of 1800 pieces
LRF2512–R01GW
Type
Mounting
Conventional (element up)
F Flip-chip (element down)
Values > R025
Values < R025
Size
Value (use IEC62 code)
Tolerance (use IEC62 code)
F 1%
G 2%
J 5%
Packing
W _Tape
T1
1206 or 2010
2512
All sizes
3000/reel
1800/reel
1000/reel
Standard
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TT electronics reserves the right to make changes in product specification without notice or liability.
04.10
All information is subject to TT electronics’ own data and is considered accurate at time of going to print.
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03.13