FR1111C Datasheet, PDF (2/2 Pages) List of Unclassifed Manufacturers – F_1111C Series Ultra Compact AllnGaP SMT LED

s Absolute Maximum Ratings
Red
Item
Symbol
FR
Power Dissipation
Pd
81
Forward Current
IF
30
Peak Forward Current
IFM
100
Reverse Voltage
VR
5
Operating Temperature _Topr
Storage Temperature
Tstg
Derating*
∆IF
Orange
FA
81
30
100
5
-40 to +85
-40 to +100
0.43 (DC) 1.0 (Pulse)
Yellow
FY
81
30
100
5
(Ta=25°C)
Units
mW
mA
mA
V
°C
°C
mA/°C
* Ta=25°C, IFM applies for the pulse width ≤ 1msec. and duty cycle ≤1/20.
s Operation Current Derating Chart (DC)
FR, FA, FY
s Taping Specifications
φ
1.5
+0.1
0
4+0.1
(1)
(φ 0.5)
Center Hole
2+0.05
4+0.1
(0.2)
Center Hole
Direction to pull
(0.9)
Quantity on tape:
Q4u0a0n0titpyieocnestape:
4p0e0r0repeielces
per reel
φ 21+0.8
2+0.5
φ 13+0.2
s Spatial Distribution
11.4+1
9+0.3
φ 180+30
s Precautions
Please follow these handling precautions to prevent damage to the chip and
ensure its reliability.
1. Soldering conditions:
• Soldering iron: Temperature at tip of iron: 280°C max. (30W max.)
Soldering time: 3 sec. max.
• Dip soldering: Preheating: 120°C ~ 150°C max. (resin surface temp.)
60-120 sec. max. Bath temperature: 260°C max. Dipping Time: 5 sec. max.
• Reflow Soldering:
°C
Operation Heating
240
150
Temperature
Pre-heating rise: 5°C/sec.
120
Cooling:
—5°C/sec.
0
60 to 120 sec.
5 sec. max
2. Cleaning:
• If cleaning is required, use the following solutions for less than 1 minute,
at less than 40°C.
• Appropriate chemicals: Ethyl alcohol and isopropyl alcohol.
• Effect of ultrasonic cleaning on the LED resin body differs depending on such
factors as the oscillator output, size of PCB and LED mounting method. The
use of ultrasonic cleaning should be enforced at proper output after confirming
there is no problem.
Product specifications subject to change without notice. PGF_1111C-0301
Stanley Electric Sales of America, Inc.
2660 Barranca Parkway, Irvine, CA 92606 • Tel: 800-LED-LCD1 (533-5231) • Fax: [phone]
Website: www.stanley-electric.com