DB1112H Datasheet, PDF (2/2 Pages) List of Unclassifed Manufacturers – D_1112H Series, Thin Type InGaN/SiC SMT LED

s Absolute Maximum Ratings
Item
Symbol
Power Dissipation
Forward Current
Peak Forward Current
Reverse Voltage
Operating Temperature
Storage Temperature
Derating*
Pd
IF
IFM
VR
Topr
Tstg
∆IF
Green
DG
76
20
48
5
Bluish-Green
DC
76
20
48
5
-40 to +85
-40 to +100
0.28 (DC) 0.69 (Pulse)
* Ta=25°C, IFM applies for the pulse width ≤ 1msec. and duty cycle ≤1/20.
Blue
DB
76
20
48
5
(Ta=25°C)
Units
mW
mA
mA
V
°C
°C
mA/°C
s Operation Current Derating Chart (DC)
s Taping Specifications
4+0.1
(1.45)
φ
1.5
+0.1
0
(0.2)
Quantity on tape:
4000 pieces
per reel
DG, DC, DB,
s Spatial Distribution
(φ 0.5)
Center
Hole
2+0.05
(1)
4+0.1
Direction to pull
φ 21+0.8
2+0.5
φ 13+0.2
s Precautions
11.4+1
9+0.3
φ 180+30
Please follow these handling precautions to prevent damage to the chip and
ensure its reliability.
1. Soldering conditions:
• Soldering iron: Temperature at tip of iron: 280°C max. (30W max.)
Soldering time: 3 sec. max.
• Dip soldering: Preheating: 120 ~ 150°C max. (resin surface temp.)
60 ~ 120 sec. max. Bath temperature: 260°C max. Dipping Time: 5 sec. max.
• Reflow Soldering:
°C
Operation Heating
240
150
Temperature
Pre-heating rise: 5°C/sec.
120
Cooling:
—5°C/sec.
0
60 to 120 sec.
5 sec. max
2. Cleaning:
• If cleaning is required, use the following solutions for less than 1 minute,
at less than 40°C.
• Appropriate chemicals: Ethyl alcohol and isopropyl alcohol.
• Effect of ultrasonic cleaning on the LED resin body differs depending on such
factors as the oscillator output, size of PCB and LED mounting method. The
use of ultrasonic cleaning should be enforced at proper output after confirming
there is no problem.
Product specifications subject to change without notice. PGD1112H-0301
Stanley Electric Sales of America, Inc.
2660 Barranca Parkway, Irvine, CA 92606 • Tel: 800-LED-LCD1 (533-5231) • Fax: [phone]
Website: www.stanley-electric.com