AD7547JRZ Datasheet, PDF (2/12 Pages) List of Unclassifed Manufacturers – MICROCIRCUIT, LIINEAR, DUAL, CMOS, 12-BIT, D/A CONVERTER, MONOLITHIC SILICON

1. SCOPE
1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in
accordance with MIL-PRF-38535, appendix A.
1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example:
5962-89657
01
L
A
Drawing number
Device type
(see 1.2.1)
Case outline
(see 1.2.2)
Lead finish
(see 1.2.3)
1.2.1 Device types. The device types identify the circuit function as follows:
Device type
Generic number
Circuit function
Gain error
01
7547S
Dual, CMOS, 12-bit D/A converter
±6.0 LSB
02
7547T
Dual, CMOS, 12-bit D/A converter
±3.0 LSB
03
7547U
Dual, CMOS, 12-bit D/A converter
±2.0 LSB
1.2.2 Case outlines. The case outlines are as designated in MIL-STD-1835 as follows:
Outline letter
Descriptive designator
Terminals
Package style
L
GDIP3-T24 or CDIP4-T24
24
3
CQCC1-N28
28
Dual-in-line
Square leadless chip carrier
1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A.
1.3 Absolute maximum ratings.
VDD to DGND......................................................................................... 0.3 V dc to +17 V dc
VREFA, VREFB, to AGND .......................................................................... ±25 V dc
VRFBA, VRFBB, to AGND.......................................................................... ±25 V dc
Digital input voltage to DGND ............................................................... 0.3 V dc to VDD +0.3 V
Voltage at IOUTA, IOUTB to DGND ............................................................ -0.3 V dc to VDD +0.3 V
AGND to DGND .................................................................................... -0.3 V dc to VDD +0.3 V
Storage temperature range ................................................................... -65°C to +150°C
Lead temperature (soldering, 10 seconds)............................................ +300°C
Power dissipation (PD) .......................................................................... 450 mW 1/
Thermal resistance, junction to case (θJC)............................................. See MIL-STD-1835
Thermal resistance, junction to ambient (θJA) ....................................... 120°C C/W
Junction temperature (TJ)...................................................................... +175°C
1.4 Recommended operating conditions.
Supply voltage range (VDD) ................................................................... 10.8 V dc to 16.5 V dc
Minimum high level input voltage .......................................................... 2.4 V dc
Maximum low level input voltage........................................................... 0.8 V dc
Ambient operating temperature range (TA) ........................................... -55°C to +125°C
Voltage at VREFA, VREFB ......................................................................... 10 V dc
Voltage at AGND, IOUTA......................................................................... 0 V dc
Voltage at AGND, IOUTB......................................................................... 0 V dc
______
1/ Derate above TA = +75°C at 6.0 mW/°C.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
C
5962-89657
SHEET
2