THAT4305 Datasheet, PDF (19/20 Pages) List of Unclassifed Manufacturers – Pre-trimmed Analog Engine® IC

Document 600067 Rev 00
Page 19
Package and Soldering Information
The THAT 4305 is available in a 16-pin QSOP
package. The package dimensions are shown in Fig-
ure 23 below, while the pinout is given in Table 1 on
page 1.
The 4305 is available only in a lead-free, "green"
package. The lead frame is copper, plated with suc-
cessive layers of nickel palladium, and gold. This
approach makes it possible to solder these devices
using lead-free and lead-bearing solders. The plastic
mold compound, and the material in which the
parts are packaged, contains no hazardous sub-
stances as specified in the RoHS directive. For more
information, including MDDS forms which disclose
the substances contained in our ICs and their pack-
aging, please visit
www.thatcorp.com/RoHShome.html.
The package has been qualified using reflow tem-
peratures as high as 260°C for 10 seconds. This
makes them suitable for use in a 100% tin solder
process. Furthermore, the 4305 has been qualified
to a JEDEC moisture sensitivity level of MSL1. No
special humidity precautions are required prior to
flow soldering the parts.
1
DA
B
C
J
E
G
H
I
0-8º
ITEM
A
B
C
D
E
G
H
I
J
MILLIMETERS
4.80 - 4.98
3.81 - 3.99
5.79 - 6.20
0.20 - 0.30
0.635 BSC
1.35 - 1.75
0.10 - 0.25
0.40 - 1.27
0.19 - 0.25
INCHES
0.189 - 0.196
0.150 - 0.157
0.228 - 0.244
0.008 - 0.012
0.025 BSC
0.0532 - 0.0688
0.004 - 0.010
0.016 - 0.050
0.0075 - 0.0098
Figure 23. QSOP-16 surface mount package drawing
THAT Corporation; 45 Sumner Street; Milford, Massachusetts 01757-1656; USA
Tel: [phone]; Fax: [phone]; Web: www.thatcorp.com