AC01 Datasheet, PDF (19/24 Pages) NXP Semiconductors – Cemented wirewound resistors

BCcomponents
Cemented wirewound resistors
Product specification
AC01/03/04/05/07/10/15/20
25
lead
length
(mm)
20
15
∆T = 40 K
MGB732
50 K 60 K
70 K
80 K
10
0
1
2
3
4
P (W)
AC04
Fig.29 Lead length as a function of the dissipation
with the temperature rise at the end of the
lead (soldering spot) as a parameter.
25
lead
length
(mm)
20
∆T = 40 K
MGB733
50 K 60 K 70 K
80 K
90 K
15
100 K
10
0
1
2
3
4
5
P (W)
AC05
Fig.30 Lead length as a function of the dissipation
with the temperature rise at the end of the
lead (soldering spot) as a parameter.
25
lead
length
(mm)
20
∆T = 40 K
MGB734
50 K 60 K 70 K
80 K
90 K
15
25
lead
length
(mm)
20
∆T = 40 K
50 K
60 K
70 K
80 K
MGB735
15
10
0
2
4
6
8
P (W)
10
0
5
10
15
20
P (W)
AC07
Fig.31 Lead length as a function of the dissipation
with the temperature rise at the end of the
lead (soldering spot) as a parameter.
AC10
Fig.32 Lead length as a function of the dissipation
with the temperature rise at the end of the
lead (soldering spot) as a parameter.
2000 Oct 20
19