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V55C2256164VB Datasheet, PDF (1/46 Pages) List of Unclassifed Manufacturers – 256Mbit MOBILE SDRAM 2.5 VOLT FBGA PACKAGE 16M X 16 | |||
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V55C2256164VB
256Mbit MOBILE SDRAM
2.5 VOLT FBGA PACKAGE 16M X 16
System Frequency (fCK)
Clock Cycle Time (tCK3)
Clock Access Time (tAC3) CAS Latency = 3
Clock Access Time (tAC2) CAS Latency = 2
Clock Access Time (tAC1) CAS Latency = 1
7
143 MHz
7 ns
5.4 ns
6 ns
19 ns
8PC
125 MHz
8 ns
6 ns
6 ns
19 ns
10
100MHz
10 ns
7 ns
8 ns
22 ns
Features
â 4 banks x 4Mbit x 16 organization
â High speed data transfer rates up to 143 MHz
â Full Synchronous Dynamic RAM, with all signals
referenced to clock rising edge
â Single Pulsed RAS Interface
â Data Mask for Read/Write Control
â Four Banks controlled by BA0 & BA1
â Programmable CAS Latency:1, 2, 3
â Programmable Wrap Sequence: Sequential or
Interleave
â Programmable Burst Length:
1, 2, 4, 8, Full page for Sequential Type
1, 2, 4, 8 for Interleave Type
â Multiple Burst Read with Single Write Operation
â Automatic and Controlled Precharge Command
â Random Column Address every CLK (1-N Rule)
â Power Down Mode and Clock Suspend Mode
â Deep Power Mode
â Auto Refresh and Self Refresh
â Refresh Interval: 8192 cycles/64 ms
â Available in 54-ball FBGA, with 9x6 ball array
with 3 depupulated rows, 13x8 mm and 54 pin
TSOP II
â VDD=2.5V, VDDQ=1.8V
â Programmable Power Reduction Feature by par-
tial array activation during Self-Refresh
â Operating Temperature Range
Commercial (0°C to 70°C)
Industrial (-40°C to +85°C)
Device Usage Chart
Operating
Temperature
Range
0°C to 70°C
-40°C to 85°C
V55C2256164VB Rev. 1.0 April 2005
Package Outline
C/T
â¢
â¢
Access Time (ns)
7
8PC
10
â¢
â¢
â¢
â¢
â¢
â¢
1
Temperature
Mark
Commercial
Extended
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