SMD1210 Datasheet, PDF (1/2 Pages) List of Unclassifed Manufacturers – UL 1434 1st Edition CSA C22.2 No. 0 CSA TIL No. CA-3A

POLYFUSE^® RESETTABLE FUSES
SMD1210
formerly No. 728
Dimensions (mm)
SMD Type, 6 V - 30 V
Standard
UL 1434 1^st Edition
CSA C22.2 No. 0 CSA TIL No. CA-3A
Approvals
cULus Recognition
TÜV
Features
This product line is designed for surface-mount
applications with a range in hold currents from
50 mA to 1.5 A and voltages from 6 V to 30 V.
These smaller devices (1210-mil footprint) are
ideally suited for palm PC, PDAs and applications
where space is constrained and circuit protec-
tion is required.
Suitable for reflow soldering
WebLinks
Further info see:
www.wickmanngroup.com
Further application info see fuseology:
www.wickmanngroup.com/download/fuseology.pdf
Solder pad Layout (mm)
2.0
2.5
Specifications
Packaging
A
Blistertape and reel Ø 178 mm
Materials
Terminals:
Solder-plated copper
TS: Solder Material: 63/37 SnPb
TF: Lead free plating on request
Max. Device Surface Temperature in Tripped State
125 °C
Operating / Storage Temperature
-40 ºC to +85 ºC (consider de-rating)
Humidity Ageing
+85 °C, 85 % R.H., 1000 hours, ± 5 % typical
resistance change
Vibration
MIL-STD-883C, Method 2007.1, Condition A,
no change
Thermal Shock
MIL-STD-202F, Method 107G
+85 °C to -40 °C 20 times, -30 % typical resistance
change
Solderability
Meets EIA Specification RS186-9E,
ANSI/J-STD-002, Category 3
Reflow only
Solvent Resistance
MIL-STD-202, Method 215, no change
Marking
“P”, Part Code
Dimensions (mm)
Model
SMD1210P005TS/TF
SMD1210P010TS/TF
SMD1210P020TS/TF
SMD1210P035TS/TF
SMD1210P050TS/TF
SMD1210P075TS/TF
SMD1210P110TS/TF
SMD1210P150TS/TF
A
Min Max
3.00 3.43
3.00 3.43
3.00 3.43
3.00 3.43
3.00 3.43
3.00 3.43
3.00 3.43
3.00 3.43
1.0
B
Min Max
2.35 2.80
2.35 2.80
2.35 2.80
2.35 2.80
2.35 2.80
2.35 2.80
2.35 2.80
2.35 2.80
1.0
C
Min Max
0.75 1.25
0.75 1.25
0.60 1.00
0.50 0.85
0.50 0.85
0.50 0.85
0.90 1.30
1.00 1.60
D
E
Min Min Max
0.25
0.20 0.50
0.25
0.20 0.50
0.25
0.20 0.50
0.25
0.20 0.50
0.25
0.20 0.50
0.25
0.20 0.50
0.25
0.20 0.50
0.25
0.20 0.50
packaging quantity
tape
3.000
3.000
3.000
4.000
4.000
4.000
3.000
2.000
Permissible continuous operating current is ≤ 100 % at ambient temperature of 20 ºC (68 ºF).
Model
(A)
I_hold
I_Trip
(A)
(V)
V_{max. dc}
(A)
I_max.
max. time to trip
(s @ A)
P_{d max.}
(W)
Resistance
Approvals
R _min.(Ω) R _typ.(Ω) R_{I max.}(Ω)
SMD1210P005TS/TF
0.05
0.15
30
10
SMD1210P010TS/TF
0.10
0.30
30
10
SMD1210P020TS/TF
0.20
0.40
30
10
SMD1210P035TS/TF
0.35
0.70
6
40
SMD1210P050TS/TF
0.50
1.00
13.2
40
SMD1210P075TS/TF
0.75
1.50
6
40
SMD1210P110TS/TF
1.10
2.20
6
40
SMD1210P150TS/TF
1.50
3.00
6
40
Please choose TS for SnPb and TF for Sn plating
NOTE:
I _hold =
I _trip =
V_max =
I _max =
Hold current: maximum current device will pass without tripping in 20 °C still air.
Trip current: minimum current at which the device will trip in 20 °C still air.
Maximum voltage device can withstand without damage at rated current (I _max)
Maximum fault current device can withstand without damage at rated voltage (V_max)
1.50 @ 0.25
1.50 @ 0.50
0.02 @ 8.00
0.20 @ 8.00
0.10 @ 8.00
0.10 @ 8.00
0.30 @ 8.00
0.50 @ 8.00
0.6
3.600 25.000 50.000 • •
0.6
1.600 7.000 15.000 • •
0.6
0.800 2.900 5.000 • •
0.6
0.320 0.810 1.300 • •
0.6
0.250 0.550 0.900 • •
0.6
0.130 0.290 0.400 • •
0.6
0.060 0.140 0.210 • •
0.8
0.040 0.070 0.110 • •
P_d = Power dissipated from device when in the tripped state at 20 °C still air.
R _min= Minimum resistance of device in initial (un-soldered) state.
R = _1max Maximum resistance of device at 20 °C measured one hour after tripping for 20 s.
Caution: Operation beyond the specified rating may result in damage and possible arcing and flame.
Specifications are subject to change without notice
Order
Information
Qty.
Order-
Model Packaging
Number
WebSite
Europe Tel: [phone] Americas Tel: [phone]
Asia Tel: [phone]
China Tel: [phone]
040614 www.wickmanngroup.com E-mail: [e-mail] E-mail: [e-mail] E-mail: [e-mail] E-mail: [e-mail]