MXC6202XJ Datasheet, PDF (1/11 Pages) List of Unclassifed Manufacturers – Ultra Low Cost, ±2.0 g Dual Axis Accelerometer With I2C Interface

Ultra Low Cost,
±2.0 g Dual Axis Accelerometer
With I²C Interface
FEATURES
• Small low profile package:
o 5.5mm x 5.5mm x 1.4mm
• Designed for very low cost applications
• RoHS compliant
• I²C Slave, FAST (≤400 KHz.) mode
• Power up/down function through I²C
• On-chip temperature sensor available
• Eight customer defined 7-bit addresses
• Most reliable industry proven product due
to no moving part in sensor structure
APPLICATIONS
The MXC6202xJ/K is optimized for motion-sensing and
tilt-sensing applications such as gesture recognition,
menu and screen navigation and HDD protection for
consumer devices including:
Information Appliances: – Cell Phones, PDA’s, MP3’s
Consumer Products: –Pedometers, Blood Pressure
Monitor, Digital Cameras
Gaming Products:– Joysticks, RF Interfaces, Handheld
games, Menu Selection, Tilt Sensing
GPS: – Electronic Compass Tilt Correction
GENERAL DESCRIPTION
The MXC6202xJ/K is an ultra low cost; dual axis
accelerometer fabricated on a standard, submicron
CMOS process. It is a complete sensing system with
on-chip mixed signal processing and integrated I²C
(Inter IC) bus, allowing the device to be connected
directly to a microprocessor eliminating the need for
A/D converters or timing resources. It measures
acceleration with a full-scale range of ±2 g and a
sensitivity of 400counts/g @3.0 V at 25°C. It can
measure both dynamic acceleration (e.g. vibration)
MXC6202xJ/K
TEMP
VDD
TP
Internal
Oscillator
VREF
CLK CLK
PD
Heater
Control
Coarse Fine Gain
Gain Adj. Adj.
Temperature
Sensor
TEMP
X aixs
Temp
Comp.
A/D
CLK
CLK TEMP CLK
Coarse Fine Gain
Gain Adj. Adj.
IIC Convertor
Y aixs
Temp
Comp.
A/D
CLK
Acceleration
Sensor
CLK CLKTEMP CLK
GND
No
Connect
No
Connect
SCL
SDA
MXC6202xJ/K FUNCTIONAL BLOCK DIAGRAM
and static acceleration (e.g. gravity). Its design is
based on heat convection and requires no solid proof
mass.
This design eliminates the stiction problems
associated with legacy technologies. MEMSIC’s solid
state design leads to significantly lower failure rates in
customer applications as well as lower loss due to
handling during manufacturing and assembly
processes.
It is packaged in a small low profile LCC surface
mount package (5.5 mm x 5.5 mm x 1.40 mm with a
maximum height of 1.50 mm) and is available for
operating temperature ranges of -10°C to +70°C (J)
and -40°C to +85°C (K).
The maximum noise floor is 2.0 mg/ Hz allowing
signals below 2milli-g to be resolved at 1 Hz
bandwidth.
Information furnished by MEMSIC is believed to be accurate and reliable.
However, no responsibility is assumed by MEMSIC for its use, or for any
infringements of patents or other rights of third parties which may result from
its use. No license is granted by implication or otherwise under any patent or
patent rights of MEMSIC.
MEMSIC, Inc.
800 Turnpike St., Suite 202, North Andover, MA 01845
Tel: [phone]
Fax: [phone]
www.memsic.com
MEMSIC MXC6202xJ/K Rev.A
Page 1 of 11
3/20/2006