LEM-51321 Datasheet, PDF (1/1 Pages) List of Unclassifed Manufacturers – SURFACE MOUNT CHIP LED LAMPS

SURFACE MOUNT CHIP LED LAMPS
Model No. LEM-51321T
FEATURES:
※Ultra compact (3.2×1.6×1.1)
※Compatible with automatic placement
equipment
※Compatible with reflow solder process
APPLICATION:
※ Indicators on printed circuit boards
※ LCD Back-lights
※ Illuminations
※ Automotive-Telecommunication
Emitted Color
Yellow Green
Material
GaP
Wavelength (nm)
570
Lens Color
Water Clear
ABSOLUTE MAXIMUM RATINGS (Ta = 25℃)
CHARACTERISTIC
SYMBOL
Power dissipation
Pm
Forward direct current
IFm
Peak forward current
Reverse voltage
Operating temperature
IFp
VRm
Topr
Storage temperature
Tstg
RATING
68
30
100
5
-30 to +80
-40 to +85
UNIT
mW
mA
mA
V
℃
℃
ELECTRO-OPTICAL CHARACTERISTICS (Ta = 25℃)
CHARACTERISTIC
SYMBOL CONDITION Min.
Luminous intensity
Forward voltage
Reverse current
Iv IF=20mA
6.0
VF IF=20mA
IR VR=5V
Peak emission wavelength λP IF=20mA
Dominant wavelength
Viewing angle
λD IF=20mA
2θ1/2 IF=20mA
Typ.
15
2.3
568
570
140
Max.
2.7
10
UNIT
mcd
V
µA
nm
nm
deg.
PACKAGE DIMENSIONS OF DEVICE
Recommended Soldering Pattern
for Reflow Soldering
Note: 1. All dimensions are in millimeters.
2. Tolerance is ±0.25mm unless otherwise specified.
Letex Technology Corp.