FSMD1206 Datasheet, PDF (1/4 Pages) List of Unclassifed Manufacturers – Surface Mount PTC FSMD1206 Series

Surface Mount PTC
FSMD1206 Series
※ Lead Free Component
Electrical Characteristics(23℃)
Application:
All high-density boards
Product Features:
Small surface mount, Solid state
Faster time to trip than standard SMD devices
Lower resistance than standard SMD devices
Operation Current: 50mA~1.5A
Maximum Voltage: 6V~60V
Temperature Range: -40℃ to 85℃
Agency Recognition: Pending
Part
Number
FSMD005-1206
FSMD010-1206
FSMD020-1206
FSMD035-1206
FSMD050-1206
FSMD075-1206
FSMD100-1206
FSMD150-1206
Hold Trip Rated Max Typical ^{Max Time to Trip}
Current Current Voltage Current Power _{Current Time}
IH,A
IT,A VMAX,Vdc IMAX, A Pd, W
A
Sec
0.05 0.15
60
0.10 0.25
60
0.20 0.40
30
0.35 0.75
16
0.50 1.00
8
0.75 1.50
6
1.00 1.80
6
1.50 3.00
6
10
0.4
0.25 1.50
10
0.4
0.50 1.00
10
0.4
8.00 0.05
40
0.4
8.00 0.10
40
0.4
8.00 0.10
40
0.6
8.00 0.20
40
0.6
8.00 0.30
40
0.8
8.00 1.00
Resistance
Tolerance
R MIN R1 MAX
Ω
Ω
3.60
1.60
0.60
0.30
0.15
0.10
0.055
0.040
50.00
15.00
2.50
1.20
0.70
0.29
0.210
0.120
IH=Hold current-maximum current at which the device will not trip at 23℃still air.
IT=Trip current-minimum current at which the device will always trip at 23 ℃ still air.
V MAX=Maximum voltage device can withstand without damage at it rated current.(I max)
I MAX= Maximum fault current device can withstand without damage at rat ed voltage (V max).
Pd=Typical power dissipated-type amount of power dissipated by the device when in the tripped state in 23 ℃ still air environment.
RMIN=Minimum device resistance at 23℃ prior to tripping.
R1MAX=Maximum device resistance at 23℃ measured 1 hour post trip.
Termination pad characteristics
Termination pad materials : solder-plated copper
NOTE : All Specification subject to change without notice . 49
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