APD032 Datasheet, PDF (1/4 Pages) List of Unclassifed Manufacturers – PACKAGE MECHANICAL SPECIFICATIONS AND PARAMETERS

INTRODUCTION
PACKAGE MECHANICAL SPECIFICATIONS AND PARAMETERS
1. Parameter Definitions:
A = Distance from top of chip to top of glass.
a = Photodiode Anode.
B = Distance from top of glass to bottom of case.
c = Photodiode Cathode (Note: cathode is common to case in metal package products unless otherwise noted).
W = Window Diameter.
F.O.V. = Filed of View (see definition below).
2. Dimensions are in inches (1 inch = 25.4 mm).
3. Pin diameters are 0.018 ± 0.001" unless otherwise specified.
4. Tolerances (unless otherwise noted)
General:
0.XX ± 0.01"
0.XXX ± 0.005"
Chip Centering:
± 0.010"
Dimension `A':
± 0.015"
5. Windows
All `UV' Enhanced products are provided with QUARTZ glass windows, 0.027 ± 0.002" thick.
All `XUV' products are provided with removable windows.
All `DLS' PSD products are provided with A/R coated glass windows.
All `FIL' photoconductive and photovoltaic products are epoxy filled instead of glass windows.
W
F .O .V .
A
F.O .V. = tan^-1 [W /2A]
UDT Sensors Inc.
Phone: [phone]
Fax: [phone]
http:\\www.udt.com
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