AP1091 Datasheet, PDF (1/7 Pages) List of Unclassifed Manufacturers – 2.4~2.5 GHz Power Amplifier

2003.03.27
AP1091
2.4~2.5 GHz Power Amplifier
AP1091 is a linear, two stages power amplifier MMIC
with high output power in 2.4GHz band utilizing
InGaP/GaAs HBT process. With the excellent linearity
performance, the device delivers 26 dBm of linear
output power (at 5V power supply)compliant with the
IEEE802.11b standard, and 19 dBm output power,
under 54Mbps OFDM (IEEE802.11g) modulation, with
only 3% EVM. The PA also includes on-chip power
detector, providing a DC voltage proportional to the
output power of the device. It features a small signal
gain of 28 dB and P1dB of 26.5 dBm at 3.3V power
supply. AP1091 is housed in a 3 x 3 (mm),16 Pin QFN
leadless package.
Major Applications
Pin Details
• 26/24 dBm Linear Output Power at 5/3.3 V
• Power Supply With 11Mb/s, CCK Modulation
• 19 dBm Linear Output Power With 54Mb/s,
OFDM Modulation (about 3% EVM)
• 28 dB Small Signal Gain
• Single 3.3 V Power Supply
• On-Chip Power Detector
• IEEE802.11b WLAN System
• IEEE802.11g (draft) WLAN System
• 2.4GHz ISM Radios
Functional Block Diagram
16
15
14
13
RF IN 1
12 ^{RF OUT}
GND ₂
Input
Match
11 ^{RF OUT}
Dect_V ₃
Dect_Out ₄
5
10 RF OUT
Bias
Detector
9 NC
6
7
8
QFN- 16 pin, 3 x 3 (mm)
Pin Number Name
Description
1
RF_IN
RF input. With on chip input matching.
2
GND
DC and RF ground.
3
Dect_V Supply voltage for on-chip power detector.
Power detector output. Connect one 5.6kΩ
4
Dect_Out resistor and one 1uF capacitor from pin4
to ground.
5
VB1
Bias current control voltage for the
first/second stage. An external resistor
bridge is necessary for single voltage
6
VB2
supply application. The detail configuration
can be found in Application Notes.
7
GND
DC and RF ground.
8
NC
9
NC
No contact
10
RF_OUT RF output. Require external matching. The
11
RF_OUT detail configuration can be found in
12
RF_OUT Application Notes
13
VCC1
Supply voltage for first stage. Some
bypass capacitors are needed for system
14
VCC1
application. The detail configuration can
be found in Application Notes.
15
16
Package
Base
NC
NC
No contact
The package ground provides circuit
Center Metal ground as well as heat dissipation path for
the power amplifier.
For more information,please contact us at:
© 2003 RF Integrated Corporation. All rights reserved.
Sales Dept.
Tel: [phone]
e-mail: [e-mail]
RF integrated Corp. reserved the right to make any changes to the specifications without notice.
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