ALN2400 Datasheet, PDF (1/6 Pages) List of Unclassifed Manufacturers – Low Noise Amplifier

Features
25 dB Gain at 2400 MHz
18 dBm P1dB
35 dBm Output IP3
1.1 dB Noise Figure
Operating at Single 5 V Supply
80 mA Current Consumption
Specifications
Description
The plerow^TM ALN-series is the compactly designed sur-
face-mount module for the use of the LNA with or without
the following gain blocks in the infrastructure equipment of
the mobile wirelss (CDMA, GSM, PCS, PHS, WCDMA,
DMB, WLAN, WiBro, WiMAX), GPS, satellite communica-
tion terminals and so on. It has an exceptional performance
of low noise figure, high gain, high OIP3, and low bias cur-
rent. The stability factor is always kept less than unity over
the application band in order to confirm its unconditionally
stable implementation to the application system environ-
ment. The surface-mount module package including the
completed matching circuit and other components neces-
sary just in case allows very simple and convenient imple-
mentation onto the system board in mass production level.
Parameter
Unit
Specification
Frequency Range
Gain
Gain Flatness
Noise Figure
Output IP3
S11 / S22
Output P1dB
Supply Current
Supply Voltage
Impedance
Max. RF Input Power
@WCDMA 4FA, Bluetooth
Package Type & Size
MHz
dB
dB
dB
dBm
dB
dBm
mA
V
Ω
dBm
mm
2300 ~ 2500
25
± 0.5
1.1
35
-18 / -10
18
80
5
50
5 , 14
SMT, 13Wx13Lx3.8H
1) Measurement conditions are as follows: T = 25°C, V_CC = 5 V, Freq. = 2400 MHz, 50 ohm system.
2) OIP3 is measured with two tones at an output power of 10 dBm / tone separated by 1 MHz.
3) Note: We recommend that the VSWR toward a source and load be less than 1:4 to avoid an unwanted oscillation.
Plerow^TM ALN2400
Low Noise Amplifier
2-stage Single Type
More Information
Website: www.asb.co.kr
E-mail: [e-mail]
Tel: [phone]
Fax: [phone]
ASB Inc., 4th Fl. Venture Town
Bldg., 367-17 Goijeong-Dong,
Seo-Gu, Daejon 302-716, Korea
Outline Drawing
plerow
ALN
ASB Inc.
TOP
BOTTOM
Pin Number
3
8
10
Others
Function
RF In
RF Out
+Vcc
Ground
SIDE
: Soldering area
: 0.4 plated thru holes to
ground plane
(Unit: mm)
1/6
SUGGESTED FOOTPRINT
www.asb.co.kr
Note: 1. The number and size of ground via holes in
a circuit board is critical for thermal RF
grounding considerations.
2. We recommend that the ground via holes be
placed on the bottom of all ground pins for
better RF and thermal performance, as
shown in the drawing at the left side.
August 2005