TL431AM Datasheet, PDF (3/3 Pages) Estek Electronics Co. Ltd – Programmable Output Voltage to 40V CHIP

PAD LAYOUT
TL431AM (chips)
Y
0,0
X
Chip size: 0,81x 0,76
Pad size : 94 x 94
Unit
: µm
1
2
3
PAD LOCATION
Pad No.
1
2
3
Pad Name
R
A
K
Description
Reference
Anode
Cathode
X
-314
-75
231
PHYSICAL CHARACTERISTIC
Wafer dia
* Wafer thickness
Scribe width
Passivation
Backside metallization
Min. lot yield
Min. wafer yield
100 mm (4")
280 … 420 ±20 µm
90 µm
PSG
Without metallization
75%
60%
* The wafer thickness small be specified in a PO or Contract
Unit: µm
Y
-299
-275
-299
3