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ET50N06 Datasheet, PDF (2/4 Pages) Estek Electronics Co. Ltd – 50 Amps,60Volts N-CHANNEL MOSFET
ET50N06
Drain Currenet Continuous
Drain Current Pulsed(Note 1)
Tc=25℃
Tc=100℃
Avalanche Energy
Repetitive(Note 1)
Single Pulse(Note 2)
Peak Diode Recovery dv/dt(Note 3)
Total Power Dissipation
Tc=25℃
Derate above 25℃
Operation Junction Temperature
Storage temperature
■ THERMAL DATA
ID
IDP
EAR
EAS
dv/dt
PD
TJ
TSTG
50
35
200
13
480
7.0
120
0.8
-55 to+150
-55~+150
A
A
A
mJ
mJ
v/ns
W
w/℃
℃
℃
PARAMETER
SYMBOL
TYP
Thermal Resistance Junction-Ambient
θJA
-
Thermal Resistance Junction-Case
θJC
-
Thermal Resistance Case-Sink
θCS
0.5
MAX
62.5
1.24
-
UNIT
℃/W
℃/W
℃/W
■ ELECTRICAL CHARACTERISTICS(TJ=25℃,unless Otherwise specified.)
PARAMETER
SYMBOL
TEST CONDITIONS
MIN
TYP
Off Characteristics
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
BVDSS
IDSS
Gate-Body Leakage
Forward
Current
Reverse
Breakdown Voltage Temperature
IGSS
△BVDSS/△TJ
VGS=0V,ID=250μA
VDS=60V,VGS=0V
VDS=48V,TC=150℃
VGS=20V,VDS=0V
VGS=-20V,VDS=0V
ID=250μA
60
0.06
On Characteristics
Gate Threshold Voltage
Static Drain-Source On-Resistance
VGS(TH)
RDS(ON)
VDS=VGS, ID=250μA
VDS=10V,ID=25A
2.2
0.019
Dynamic Characteristics
Input Capacitance
CISS
900
Output Capacitance
COSS
VDS=25V,VGS=0V,f=1MHZ
430
Reverse Transfer Capacitance
CRSS
80
■ ELECTRICAL CHARACTERISTICS(Cont.)
PARAMETER
SYMBOL TEST CONDITIONS
MIN TYP
Switching Characteristics
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
tD(ON)
40
tR
VDD=30V,ID=25A,RG=50Ω
100
tD(OFF)
(Note4,5)
90
tF
80
QG
30
QGS
VDS=48V,VGS=10V,ID=50A(Note4,5)
9.6
QGD
10
Drain-Source Diode Characteristics
Drain-Source Diode Forward Voltage
Continuous Drain-Source Current
VSD
VGS=0V,ISD=50A
ISD
Pulsed Drain-Source Current
ISM
Reverse Recovery Time
tRR
54
MAX UNIT
1
10
100
-100
V
μA
μA
nA
nA
V/℃
3.8
V
0.023
Ω
1220
pF
550
pF
100
pF
MAX UNIT
60
ns
200
ns
180
ns
160
ns
40
nC
-
nC
-
nC
1.5
V
50
A
200
A
ns
2
BEIJING ESTEK ELECTRONICS CO.,LTD