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M24D816512DA Datasheet, PDF (6/13 Pages) Elite Semiconductor Memory Technology Inc. – 8-Mbit (512K x 16) Pseudo Static RAM
ESMT
AC Test Loads and Waveforms
M24D816512DA
Parameters
R1
R2
RTH
VTH
1.8V (VCC)
14000
14000
7000
0.90
Switching Characteristics Over the Operating Range [9, 10, 11, 12]
Parameter
Read Cycle
tRC[14]
tCD [15]
tAA
tOHA
tACE
tDOE
tLZOE
tHZOE
tLZCE
tHZCE
tDBE
tLZBE
tHZBE
Description
Read Cycle Time
Chip Deselect Time CE1 = HIGH orCE2 = LOW,
BLE / BHE High Pulse Time
Address to Data Valid
Data Hold from Address Change
CE1 LOW and CE2 HIGH to Data Valid
OE LOW to Data Valid
OE LOW to Low Z[10, 11, 13]
OE HIGH to High Z[10, 11, 13]
CE1 LOW and CE2 HIGH to Low Z[10, 11, 13]
CE1 HIGH or CE2 LOW to High Z[10, 11, 13]
BLE / BHE LOW to Data Valid
BLE / BHE LOW to Low Z[10, 11, 13]
BLE / BHE HIGH to Low Z[10, 11, 13]
-55
Min.
Max.
55
80000
5
55
5
55
25
5
20
10
20
55
5
20
Unit
Ω
Ω
Ω
V
-70
Min. Max.
Unit
70
80000 ns
ns
5
70
ns
5
ns
70
ns
35
ns
5
ns
25
ns
10
ns
25
ns
70
ns
5
ns
25
ns
Notes:
9.Test conditions for all parameters other than tri-state parameters assume signal transition time of 1 ns/V, timing reference levels
of VCC(typ.)/2, input pulse levels of 0V to VCC, and output loading of the specified IOL/IOH as shown in the “AC Test Loads and
Waveforms” section.
10.At any given temperature and voltage conditions tHZCE is less than tLZCE, tHZBE is less than tLZBE, tHZOE is less than tLZOE, and
tHZWE is less than tLZWE for any given device. All low-Z parameters will be measured with a load capacitance of 30 pF (3V)
11.tHZOE, tHZCE, tHZBE, and tHZWE transitions are measured when the outputs enter a high-impedance state.
12.The internal Write time of the memory is defined by the overlap of WE , CE1 = VIL and CE2 = VIH, BHE and/or BLE = VIL.
All signals must be ACTIVE to initiate a write and any of these signals can terminate a write by going INACTIVE. The data input
set-up and hold timing should be referenced to the edge of the signal that terminates the write.
13.High-Z and Low-Z parameters are characterized and are not 100% tested.
14.If invalid address signals shorter than min. tRC are continuously repeated for 80 µs, the device needs a normal read timing (tRC)
or needs to enter standby state at least once in every 80 µs.
15.Whenever CE1 = HIGH or CE2 = LOW, BHE / BLE are taken inactive, they must remain inactive for a minimum of 5 ns.
Elite Semiconductor Memory Technology Inc.
Publication Date : Jul. 2007
Revision : 1.0
6/13