English
Language : 

M24L28256SA Datasheet, PDF (3/12 Pages) Elite Semiconductor Memory Technology Inc. – 2-Mbit (256K x 8) Pseudo Static RAM
ESMT
M24L28256SA
Maximum Ratings
(Above which the useful life may be impaired. For user
guide-lines, not tested.)
Storage Temperature ...................................–65°C to +150°C
Ambient Temperature with
Power Applied ..............................................–55°C to +125°C
Supply Voltage to
Ground Potential . ............... ............ ...........−0.4V to 4.6V
DC Voltage Applied to Outputs
in High-Z State[4, 5, 6] .................................−0.4V to 3.7V
DC Input Voltage[4, 5, 6].................... .........−0.4V to 3.7V
Output Current into Outputs (LOW) ...............................20 mA
Static Discharge Voltage ........................................ >2001V
(per MIL-STD-883, Method 3015)
Latch-up Current ....................................................> 200 mA
Operating Range
Range
Extended
Industrial
Ambient
Temperature (TA)
−25°C to +85°C
−40°C to +85°C
VCC
2.7V to 3.6V
2.7V to 3.6V
Electrical Characteristics (Over the Operating Range)
Parameter
Description
Test Conditions
VCC
Supply Voltage
VOH
Output HIGH
Voltage
IOH = −0.1 mA
VOL
Output LOW
Voltage
IOL = 0.1 mA
VIH
Input HIGH
Voltage
VIL
Input LOW Voltage
IIX
Input Leakage
Current
GND ≤VIN ≤ VCC
IOZ
Output Leakage
Current
GND ≤ VOUT ≤ VCC , Output
Disable
ICC
VCC Operating
Supply Current
f = fMAX = 1/tRC
f = 1 MHz
VCC = 3.6V
IOUT = 0mA
CMOS levels
Automatic CE
CE ≥ VCC−0.2V,
ISB1
Power-Down
Current
VIN ≥ VCC − 0.2V, VIN ≤ 0.2V,
f = fMAX (Address and Data Only),
—CMOS Inputs
f=0
ISB2
Automatic CE
Power-Down
Current
—CMOS Inputs
CE ≥ VCC−0.2V,
VIN ≥ VCC − 0.2V, VIN ≤ 0.2V,
f = 0, VCC = 3.6V
Min.
2.7
VCC-
0.4
0.8*
VCC
-0.4
-1
-1
-55
Typ
.[3]
Max.
3.0 3.6
0.4
VCC+
0.4
0.4
+1
+1
14 22
1
5
40 250
9 40
Min.
2.7
VCC-
0.4
0.8*
VCC
-0.4
-1
-1
-70
Typ.
[3]
3.0
8
1
40
9
Max.
3.6
0.4
VCC
+0.4
0.4
+1
+1
15
5
250
40
Unit
V
V
V
V
V
µA
µA
mA
µA
µA
Capacitance[7]
Parameter
Description
CIN
COUT
Input Capacitance
Output Capacitance
Test Conditions
TA = 25°C, f = 1 MHz
VCC = VCC(typ)
Max.
8
8
Unit
pF
pF
Thermal Resistance[7]
Parameter
Description
ΘJA
Thermal Resistance(Junction to Ambient)
ΘJC
Thermal Resistance (Junction to Case)
Test Conditions
Test conditions follow standard test
methods and procedures for measuring
thermal impedance, per EIA/ JESD51.
BGA
55
17
Unit
°C/W
°C/W
Notes:
4.VIH(MAX) = VCC + 0.5V for pulse durations less than 20 ns.
5.VIL(MIN) = –0.5V for pulse durations less than 20 ns.
6.Overshoot and undershoot specifications are characterized and are not 100% tested.
7.Tested initially and after design or process changes that may affect these parameters.
Elite Semiconductor Memory Technology Inc.
Publication Date : Jul. 2008
Revision : 1.1
3/12