MC-206 Datasheet, PDF (1/1 Pages) Epson Company – THIN SMD LOW/MEDIUM-FREQUENCY CRYSTAL UNIT

THIN SMD LOW/MEDIUM-FREQUENCY CRYSTAL UNIT
MC-206
Product number (please refer to page 1)
Q1 xMC2 0 6 x x x x x 0 0
• High-density mounting-type SMD of Max. 2.0 mm thickness.
• High heat resistance allows reflow soldering.
• Excellent environmental capability.
Crystal unit
Actual size
Specifications (characteristics)
Item
Symbol
Specifications
Remarks
Nominal frequency
f
32.768 kHz
32.000 kHz to 100.000 kHz
Temperature
range
Storage temperature TSTG
Operating temperature _TOPR
Maximum drive level
GL
Frequency tolerance (standard)
∆f/f
Peak temperature (frequency)
θT
Temperature coefficient (frequency)
a
Load capacitance
CL
Series resistance
R1
Motional capacitance
C1
Shunt capacitance
C0
Insulation resistance
IR
Aging
fa
Shock resistance
S.R.
-55 °C to +125 °C
-40 °C to +85 °C
1.0 µW Max.
±20 x 10^-6, ±50 x 10^-6
±50 x 10^-6, ±100 x 10^-6
+25 °C ±5 °C
-0.04 x 10^-6 / °C² Max.
7 pF, 12.5 pF
55 kΩ Max.
50 kΩ to 20 kΩ
1.8 fF Typ.
3.0 fF Max.
0.9 pF Typ.
1.5 pF Max.
500 MΩ Min.
±3 x 10^-6 / year Max.
±5 x 10^-6 / year Max.
±5 x 10^-6 Max.
Stored as bare product after unpacking
Ta=+25 °C, DL=0.1 µW
Please specify
As per below table
Ta= +25 °C ±3 °C, first year
Three drops on a hard board from 750 mm or excitation test
with 29400 m/s² x 0.3 ms x 1/2 sine wave x 3 directions
Series resistance
Frequency (kHz)
Series resistance (Ω)
32 ≤ f < 38
50 kΩ Max.
38 ≤ f < 65.536
40 kΩ Max.
65.536 ≤ f < 75
25 kΩ Max.
75 ≤ f ≤100
20 kΩ Max.
External dimensions
7.3 Max.
#4
#3
E. A. 67
#1
#2
(Unit: mm)
Internal connection
#4
#3
Recommended soldering pattern ^{(Unit: mm)}
1.2
3.88
1.2
#1
#2
0.4
0.4
5.08
Do not connect #2 and #3 to external device.
Metal may be exposed on the top or bottom of this product. This won't affect any quality, reliability or electrical spec.
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