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EPC-1300-3.0-4 Datasheet, PDF (1/2 Pages) EPIGAP optoelectronic GmbH – Photodiode-Chip
Photodiode-Chip
Wavelength range
Infrared
Type
Planar
EPC-1300-3.0-4
16.05.2008
rev. 03
Technology
Electrodes
InGaAs/InP
Both on top side
3350 ±20
Ø3000
typ. dimensions in µm
typ. thickness
330 (±20) µm
top side*
bond gold 1.0 µm
Description
Broadband photodiode with
maximum response in the
NIR-region and enhanced
responsivity in the visible
range, no rear side
metalization
Ø200
Miscellaneous Parameters
Tamb = 25°C, unless otherwise specified
Parameter
rear side
Applications
no metalization
Optical communications,
* Bond pad assigment:
Pos. 1 - Anode
safety equipment, light
barriers
Ø150
Pos. 2 - Cathode
Test сonditions
Symbol
Value
Unit
Active area
Operating temperature range
Storage temperature range
Temperature coefficient of ID
T = -40…120°C
A
Tamb
Tstg
TC(ID)
7.0
-40 to +125
-40 to +125
7.4
mm²
°C
°C
%/K
Optical and Electrical Characteristics
Tamb = 25°C, unless otherwise specified
Parameter
Test
conditions
Forward voltage
IF = 10 mA
Breakdown voltage2)
IR = 10 µA
Sensitivity range at 10 %
VR = 0 V
Spectral bandwidth at 50 %
Responsivity at 1300 nm1)
VR = 0 V
VR = 0 V
Dark current
VR = 5 V
Shunt resistance
VR = 10 mV
Noise equivalent power
λ = 1300 nm
Specific detectivity
λ = 1300 nm
Junction capacitance
VR = 0 V
1)measured on bare chip on TO-18 header
2)for information only
Symbol
VF
VR
λ
∆λ0,5
Sλ
ID
RSH
NEP
D*
CJ
Min
Typ
Max
Unit
0.6
V
5
V
440
1710
nm
680
nm
0.9
A/W
5
30
nA
15
30
MΩ
5.2x10-14
5.1x1012
W/ Hz
cm ⋅ Hz ⋅ W −1
1000
1300
pF
Labeling
Type
Typ. ID [nA] Typ. Sλ[A/W]
EPС-1300-3.0-4
Packing: Chips on adhesive film with wire-bond side on top
Lot N°
Quantity
*Note: All measurements carried out with EPIGAP equipment
We reserve the right to make changes to improve technical design and may do so without further notice.
Parameters can vary in different applications. All operating parameters must be validated for each application by the customers themselves.
EPIGAP Optoelektronik GmbH, D-12555 Berlin, Köpenicker Str.325 b, Haus 201
Tel.: +49-30-6576 2543, Fax : +49-30-6576 2545
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