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| B72510E0300K062 Datasheet, PDF (6/14 Pages) EPCOS – Ceramic transient voltage suppressors | |||
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Ceramic transient voltage suppressors
SMD multilayer varistor, E series
B72510E0300K062
CT0805K30G
Recommended soldering profiles
Reflow soldering
Recommended temperature characteristic for reflow soldering following JEDEC J-STD-020D
Profile feature
Sn-Pb eutectic assembly Pb-free assembly
Preheat and soak
- Temperature min
- Temperature max
- Time
Tsmin
Tsmax
tsmin to tsmax
100 °C
150 °C
60 ⦠120 s
150 °C
200 °C
60 ⦠180 s
Average ramp-up rate
Tsmax to Tp 3 °C/s max.
3 °C/s max.
Liquidous temperature
TL
Time at liquidous
tL
Peak package body temperature
Tp1)
Time (tp)3) within 5 °C of specified
classification temperature (Tc)
183 °C
60 ⦠150 s
220 °C ⦠235 °C2)
20 s3)
217 °C
60 ⦠150 s
245 °C ⦠260 °C2)
30 s3)
Average ramp-down rate
Tp to Tsmax 6 °C/s max.
6 °C/s max.
Time 25 °C to peak temperature
maximum 6 min
maximum 8 min
1) Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.
2) Depending on package thickness. For details please refer to JEDEC J-STD-020D.
3) Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
Note: All temperatures refer to topside of the package, measured on the package body surface.
Number of reflow cycles: 3
PPD ML PD
Please read Cautions and warnings and
Important notes at the end of this document.
Page 6 of 14
2012-02-15
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