B57431V2104J062 Datasheet, PDF (4/7 Pages) EPCOS – SMD NTC Thermistor with Ni-Barrier Termination

SMD NTC Thermistor
SMD NTC Thermistor with Ni-Barrier Termination
Data sheet
Mounting Instructions
1. Termination
Ni-barrier termination (Ag/Ni/Sn)
B57431V2104J062
Inner electrode
Base layer - silver
Diffusion barrier - nickel
Outer layer - tin
2. Recommended geometry of solder pads
Size A
[mm]
0805 1.3
B
[mm]
1.2
C
[mm]
1.0
D
[mm]
3.4
B
CB
A
A
D
3. Requirements for Solderability
- Wettability test in accordance with IEC 60068-2-58 (= JIS C 0054) :
Preconditioning: Immersion into flux F-SW 32.
Evaluation criteria: Wetting of soldering areas ≥ 95%.
Pb-containing solder: Sn(60)Pb(40)
Bath temperature (°C): 215 ± 3
Dwell time (s): 3 ± 0.3
Pb-free solder: Sn(95.1-96.0)Ag(3.0-4.0)Cu(0.5-0.9)
Bath temperature (°C): 245 ± 5
Dwell time (s): 3 ± 0.3
- Soldering heat resistance test in accordance with IEC 60068-2-58 (= JIS C 0054) :
Preconditioning: Immersion into flux F-SW 32.
Evaluation criteria: Leaching of side edges ≤ 1/3.
Solder: Sn(60)Pb(40), Sn(95.1-96.0)Ag(3.0-4.0)Cu(0.5-0.9)
Bath temperature (°C): 260 ± 5
Dwell time (s): 10 ± 1
ISSUE DATE 08.12.2005
ISSUE
a
PUBLISHER
KB S PE
PAGE 4/7