G1565 Datasheet, PDF (11/20 Pages) EPCOS – NTC thermistors for temperature measurement

Temperature measurement
Glass-encapsulated sensors for media contact
B57565G1
G1565
Reflow soldering
Recommended temperature characteristic for reflow soldering following JEDEC J-STD-020D
Profile feature
Preheat and soak
- Temperature min
T_smin
- Temperature max
T_smax
- Time
t_smin to t_smax
Average ramp-up rate
T_smax to T_p
Liquidous temperature
T_L
Time at liquidous
t_L
Peak package body temperature T_p1)
Time (t_P)³⁾ within 5 °C of specified
classification temperature (T_c)
Average ramp-down rate
T_p to T_smax
Time 25 °C to peak temperature
Sn-Pb eutectic assembly
100 °C
150 °C
60 ... 120 s
3 °C/ s max.
183 °C
60 ... 150 s
220 °C ... 235 °C²⁾
20 s³⁾
6 °C/ s max.
maximum 6 min
Pb-free assembly
150 °C
200 °C
60 ... 180 s
3 °C/ s max.
217 °C
60 ... 150 s
245 °C ... 260 °C²⁾
30 s³⁾
6 °C/ s max.
maximum 8 min
1) Tolerance for peak profile temperature (TP) is defined as a supplier minimum and a user maximum.
2) Depending on package thickness. For details please refer to JEDEC J-STD-020D.
3) Tolerance for time at peak profile temperature (tP) is defined as a supplier minimum and a user maximum.
Note: All temperatures refer to topside of the package, measured on the package body surface.
Number of reflow cycles: 3
Please read Cautions and warnings and
Important notes at the end of this document.
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