EPC111_17 Datasheet, PDF (11/14 Pages) Espros Photonics corp – Fully integrated standalone light barrier driver & receiver

Layout Information (all measures in mm,
CSP-10 Package
Mechanical Dimensions
1.89 +0.00/-0.09
File: Unben annt
Part Name
<Partname>
Bottom View
)
Designed
Approved
Scale
Page
<Na m e>
<Na m e>
M 1:1
1
Part No.
<x000 000>
26.02.2009
<Data>
DIN A4
epc111/112
Layout Recommendations
0.15
∅ 0.3
0.5
0.5
Pin 1
0.15
Solder balls Sn97.5Ag2.5
0.5
0.5
2.5
no solder mask inside this area
Revision:
Dimension A:
-
0.12 ±0.02
A
0.15 ±0.02
Figure 13: CSP10: Mechanical dimensions
Figure 14: CSP10: Layout recommendation
Recommendations for reliable soldering of solder balls:
• Use a pad layout similar to the one shown in Figure 14. Notice that all tracks should go underneath the solder mask area.
• Do not connect any pins direct pin to pin inside of the opening of the solder mask.
• In case of the conductors are with a Au-Ni surface finish the preferred landing pad design for the solder balls will be covering the
round landing pad with a gold surface finish as a solderable area only.
QFN-16 Package
Note: For sampling only. Limited quantities. Please inquire.
<Title>
Opening in solder mask
le:
is document is confidential and protected by law and international trades. It must not be shown to any third party nor be copied in any form without our written perm^Ci^ossⁿio^dn.^{uctor layout}
<name>
20.09.2012
Page 1
NC_GND
LED
NC
NC_GND
Top View
1
2
3
4
NC_GND
GND
PD
NC_GND
Shielding of PD pin
© 2013 ESPROS Photonics Corporation
Characteristics subject to change without notice
Figure 15: QFN-16: Layout recommendation
11
Datasheet epc111_112 - V2.5
www.espros.ch