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EN25P16 Datasheet, PDF (32/32 Pages) Eon Silicon Solution Inc. – 16 Mbit Uniform Sector, Serial Flash Memory
Revisions List
EN25P16
Revision No Description
Date
A
Initial release
2006/05/25
B
1. Add 16 pin SOP 300mil body width for package options in 2006/08/08
page 1
2. Add 16 pin SOP 300mil diagram in Figure 1
3. Add INSTRUCTIONS description in page 9
4. Add figure 26 of SOP 300mil package
5. Add 16 pin SOP package option ‘F’ to ordering info
C
1. Change clock rate from 50MHz to 75MHz,
2006/12/25
Page program time 1.4 ms typical to 1.5 ms typical
Sector erase time 300 ms typical to 800 ms
Chip erase time 10 seconds to 18 seconds typical
in page 1
2. Change Table 8 DC Characteristics in page 22
(1) Add ICC3 for 75MHz
3. Change Table 10 to 75MHz AC Characteristics in page 23
(1) Change FR from 50 to 75MHz
(2) Change fR from 33 to 50MHz
(3) Change tCLH from 9ns to 6ns
(4) Change tCLL from 9ns to 6ns
(5) Change tSHQZ from 9ns to 6ns
(6) Change tHLQZ from 9ns to 6ns
(7) Change tHHQZ from 9ns to 6ns
(8) Change tCLQV from 9ns to 6ns
(9) Change Page program time 1.4ms typical to 1.5ms
(10) Change Sector erase time 0.3 / 0.6 seconds to 0.8 / 2
seconds for typical and maximum
(11)Change Chip erase time 10 / 20 seconds to 18 / 35
seconds for typical and maximum
4. Add Table 11: 50MHz AC Characteristics in page 24
(1) Change Page program time 1.4ms typical to 1.5ms
(2) Change Sector erase time 0.3 / 0.6 seconds to 0.8 / 2
seconds for typical and maximum
(3) Change Chip erase time 10 / 20 seconds to 18 / 35
seconds for typical and maximum
5. Add 75MHz option in Ordering Information in page 31
6. Change Table 8. DC Characteristics VIL Max 0.3 VCC to 0.2
VCC in page 22
This Data Sheet may be revised by subsequent versions 32 ©2004 Eon Silicon Solution, Inc., www.essi.com.tw
or modifications due to changes in technical specifications.
Rev. C, Issue Date: 2006/12/25