EMP216MAAW Datasheet, PDF (3/10 Pages) Emerging Memory & Logic Solutions Inc – 2Mx16 Pseudo Static RAM

2Mb x16 Pseudo Static RAM
GENERAL WAFER SPECIFICATIONS
- Process Technology : 0.125um CMOS Deep trench process
- 3 Metal layers including local inter-connection
- Wafer thickness : 725 +/- 25um
- Wafer Diameter : 8-inch
PAD DESCRIPTION
Name
Function
CS# Chip select inputs
OE# Output enable input
WE# Write enable input
ZZ# Low Power Control
DQ_0-15 Data In-out
A_0-20 Address inputs
Name
Function
LB#
UB#
VCC
Lower byte (DQ_0~7)
Upper byte (DQ_8~15)
Power supply
VCCQ I/O Power supply
VSS(Q) Ground
NC
No connection
Preliminary
EMP216MAAW Series
2Mx16 Pseudo Static RAM
¢
Rev 0.0